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• Vulnerability and improvement of reinforced ECC flexural members under displacement reversals: Experimental investigation and computational analysis

  Hung, C. C., Yen, W. M. & Yu, K. H., 2016 3月 15, 於: Construction and Building Materials. 107, p. 287-298 12 p.

  研究成果: Article › 同行評審
  40 引文 斯高帕斯（Scopus）

• Vulnerability evaluation of scoured bridges under floods

  Hung, C. C. & Yau, W. G., 2017 2月 1, 於: Engineering Structures. 132, p. 288-299 12 p.

  研究成果: Article › 同行評審
  22 引文 斯高帕斯（Scopus）

• Vulnerability of super extra edge-connected graphs

  Cheng, C. W., Hsieh, S. Y. & Klasing, R., 2020 3月, 於: Journal of Computer and System Sciences. 108, p. 1-9 9 p.

  研究成果: Article › 同行評審
  6 引文 斯高帕斯（Scopus）

• Vulnerable option pricing under heterogeneity and its applications in Taiwan warrant market

  Liu, Y. H. & Jiang, I. M., 2010 9月, 於: International Journal of Fuzzy Systems. 12, 3, p. 243-251 9 p.

  研究成果: Article › 同行評審
  1 引文 斯高帕斯（Scopus）

• W/Zr mixed oxide supported on mesoporous silica as catalyst for n-pentane isomerization

  Li, T., Wong, S. T., Chao, M. C., Lin, H. P., Mou, C. Y. & Cheng, S., 2003 1月 1, 於: Studies in Surface Science and Catalysis. 146, p. 569-572 4 p.

  研究成果: Article › 同行評審
  2 引文 斯高帕斯（Scopus）

• WAAS utilization of the new civil signal at L2

  Jan, S-S., 2007 12月 1, 20th International Technical Meeting of the Satellite Division of The Institute of Navigation 2007, ION GNSS 2007. p. 984-989 6 p. (20th International Technical Meeting of the Satellite Division of The Institute of Navigation 2007 ION GNSS 2007; 卷 4).

  研究成果: Conference contribution

• Wafer Manufacturing: Shaping of Single Crystal Silicon Wafers

  Kao, I. & Chung, C., 2020 1月 1, wiley. 290 p.

  研究成果: Book
  6 引文 斯高帕斯（Scopus）

• Wafer-Scale Growth of WSe₂ Monolayers Toward Phase-Engineered Hybrid WO_x/WSe₂ Films with Sub-ppb NO_x Gas Sensing by a Low-Temperature Plasma-Assisted Selenization Process

  Medina, H., Li, J. G., Su, T. Y., Lan, Y. W., Lee, S. H., Chen, C. W., Chen, Y. Z., Manikandan, A., Tsai, S. H., Navabi, A., Zhu, X., Shih, Y. C., Lin, W. S., Yang, J. H., Thomas, S. R., Wu, B. W., Shen, C. H., Shieh, J. M., Lin, H. N., Javey, A., 及其他2Wang, K. L. & Chueh, Y. L., 2017 2月 28, 於: Chemistry of Materials. 29, 4, p. 1587-1598 12 p.

  研究成果: Article › 同行評審
  72 引文 斯高帕斯（Scopus）

• Wafer-scale photonic and plasmonic crystal sensors

  George, M. C., Liu, J. N., Farhang, A., Williamson, B., Black, M., Wangensteen, T., Fraser, J., Petrova, R. & Cunningham, B. T., 2015 1月 1, NSTI: Advanced Manufacturing, Electronics and Microsystems - TechConnect Briefs 2015. Romanowicz, B. & Laudon, M. (編輯). Taylor and Francis Inc., p. 160-162 3 p. (NSTI: Advanced Materials - TechConnect Briefs 2015; 卷 4).

  研究成果: Conference contribution

• Wafer-scale plasmonic and photonic crystal sensors

  George, M. C., Liu, J. N., Farhang, A., Williamson, B., Black, M., Wangensteen, T., Fraser, J., Petrova, R. & Cunningham, B. T., 2015, Plasmonics: Metallic Nanostructures and Their Optical Properties XIII. Tsai, D. P. & Boardman, A. D. (編輯). SPIE, 95471F. (Proceedings of SPIE - The International Society for Optical Engineering; 卷 9547).

  研究成果: Conference contribution
  2 引文 斯高帕斯（Scopus）

• Wafer size MOS₂ with few monolayer synthesized by H₂S sulfurization

  Ho, Y. T., Chu, Y. C., Wei, L. L., Luong, T. T., Lin, C. C., Cheng, C. H., Hsu, H. R., Tu, Y. Y. & Chang, E. Y., 2017 5月 4, China Semiconductor Technology International Conference 2017, CSTIC 2017. Liang, S., Shi, Y., Huang, R., Lin, Q., Huang, D., Wu, H., Wang, Y., Claeys, C., Lai, K., Zhang, Y., Song, P., Shi, V. & Guo, Z. (編輯). Institute of Electrical and Electronics Engineers Inc., 7919883. (China Semiconductor Technology International Conference 2017, CSTIC 2017).

  研究成果: Conference contribution

• Wafer Transfer of Hydrothermally Grown ZnO Film and Its Application on Vertical Structure Ultraviolet Photodetectors with Metal Substrate

  Hung, C. H., Wang, S-J., Wu, N. S., Wu, C. H., Liu, P. Y., Hao-Ping, Y., Lin, T. H. & Wu, C. H., 2016 9月 26, 2016 International Conference on Solid State Devices and Materials (SSDM’16). Tsukuba, Japan

  研究成果: Conference contribution

• Wage Rigidity with Separating Exchange Markets

  Wang, F., 2002, 於: International Review of Economics and Business.

  研究成果: Article › 同行評審

• Waiting as a signal: Why women are delaying fertility?

  Ng, W. L. & Wang, Y. C., 2020 5月, 於: Economic Modelling. 87, p. 471-479 9 p.

  研究成果: Article › 同行評審
  4 引文 斯高帕斯（Scopus）

• Wake characteristics of a model wind turbine and an actuator disk model

  Miau, J. J., Lin, S. A., Fong, J. H., Lin, C. C., Leu, T. S., Wang, T. C. & Tseng, C. C., 2015 9月 1, 於: Journal of Aeronautics, Astronautics and Aviation. 47, 3, p. 307-314 8 p.

  研究成果: Article › 同行評審

• Wake flow analysis of a vortex shedder situated downstream of double elbows out-of-plane

  Karman, R. & Miau, J. J., 2008 12月 1, 於: Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao. 29, 6, p. 445-455 11 p.

  研究成果: Article › 同行評審

• Wake influence on flow in a circular-to-rectangular transition duct. A water-tunnel study using visualization techniques

  Miau, J-J., Wu, S. F., Chou, J-H. & Lin, C. K., 1990 2月 1, 於: Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao. 11, 1, p. 1-11 11 p.

  研究成果: Article › 同行評審

• Wake-up logic optimizations through selective match and wakeup range limitation

  Hsiao, K. S. & Chen, C. H., 2006 10月, 於: IEEE Transactions on Very Large Scale Integration (VLSI) Systems. 14, 10, p. 1089-1102 14 p., 1715346.

  研究成果: Article › 同行評審
  2 引文 斯高帕斯（Scopus）

• Waldenstrom's macroglobulinemia with peripheral neuropathy - The role of IgM M-protein in autoimmune mechanism

  Wang, C. R., Chiu, H. C., Hsieh, H. C., Hsieh, R. P., Wu, Y. C. & Chuang, C. Y., 1988, 於: Chinese Journal of Microbiology and Immunology. 21, 1, p. 9-15 7 p.

  研究成果: Article › 同行評審

• Walking a Tightrope: Conflicting Visions of America in Colum McCann’s Let the Great World Spin

  Liao, P-C., 2018 9月, The 53rd ASAK International Conference. Seoul, Korea

  研究成果: Conference contribution

• Walking improves sleep in individuals with cancer: A meta-analysis of randomized, controlled trials

  Chiu, H. Y., Huang, H. C., Chen, P. Y., Hou, W. H. & Tsai, P. S., 2015 3月 1, 於: Oncology Nursing Forum. 42, 2, p. E54-E62

  研究成果: Article › 同行評審
  14 引文 斯高帕斯（Scopus）

• Walking in colonial Taiwan: A study on urban modernization of Taipei, 1895-1945

  Wu, P. S., 2010, 於: Journal of Asian Architecture and Building Engineering. 9, 2, p. 307-314 8 p.

  研究成果: Article › 同行評審
  9 引文 斯高帕斯（Scopus）

• Walking machines

  Yan, H. S., 2007 1月 1, History of Mechanism and Machine Science. Springer Netherland, p. 269-302 34 p. (History of Mechanism and Machine Science; 卷 3).

  研究成果: Chapter

• Walking motion generation, synthesis, and control for biped robot by using PGRL, LPI, and fuzzy logic

  Li, T. H. S., Su, Y. T., Lai, S. W. & Hu, J. J., 2011 6月, 於: IEEE Transactions on Systems, Man, and Cybernetics, Part B: Cybernetics. 41, 3, p. 736-748 13 p., 5640679.

  研究成果: Article › 同行評審
  60 引文 斯高帕斯（Scopus）

• Walking pattern classification and walking distance estimation algorithms using gait phase information

  Wang, J. S., Lin, C. W., Yang, Y. T. C. & Ho, Y. J., 2012, 於: IEEE Transactions on Biomedical Engineering. 59, 10, p. 2884-2892 9 p., 26.

  研究成果: Article › 同行評審
  75 引文 斯高帕斯（Scopus）

• Walking patterns of normal children aged from 4 to 6 years old and young adults in Taiwan

  Yang, C. H., Chou, Y. L., Su, F., Lin, C-J., Chen, H. C., Giang, S. S. & Chang, W. C., 1996 1月 1, 於: Biomedical Engineering - Applications, Basis and Communications. 8, 2, p. 167-176 10 p.

  研究成果: Article › 同行評審

• Walking while performing working memory tasks changes the prefrontal cortex hemodynamic activations and gait kinematics

  Lin, M. I. B. & Lin, K. H., 2016 5月 18, 於: Frontiers in Behavioral Neuroscience. 10, MAY, 92.

  研究成果: Article › 同行評審
  53 引文 斯高帕斯（Scopus）

• Wall-following and Navigation Control of Mobile Robot Using Reinforcement Learning Based on Dynamic Group Artificial Bee Colony

  Lin, T. C., Chen, C. C. & Lin, C. J., 2018 10月 1, 於: Journal of Intelligent and Robotic Systems: Theory and Applications. 92, 2, p. 343-357 15 p.

  研究成果: Article › 同行評審
  17 引文 斯高帕斯（Scopus）

• Wall heating effects in mixed convection in vertical annulus with variable properties

  Tsou, F. K., Aung, W., Moghadam, H. E. & Gau, C., 1992, 於: Journal of thermophysics and heat transfer. 6, 2, p. 273-276 4 p.

  研究成果: Article › 同行評審
  3 引文 斯高帕斯（Scopus）

• Wall shape effects on straight doublet equilibria

  Dobrott, D., Chu, M-S. & Ohkawa, T., 1973 1月 1, 於: Physics of Fluids. 16, 11, p. 1870-1875 6 p.

  研究成果: Article › 同行評審

• Wall shear stress mapping for human femoral artery based on ultrafast ultrasound vector Doppler estimations

  Wang, I. C., Huang, H., Chang, W. T. & Huang, C. C., 2021 11月, 於: Medical Physics. 48, 11, p. 6755-6764 10 p.

  研究成果: Article › 同行評審

  開啟存取
  2 引文 斯高帕斯（Scopus）

• Wall stabilization of axisymmetric modes in noncircular tokamak plasmas

  Chu, M. S. & Miller, R. L., 1978, 於: Physics of Fluids. 21, 5, p. 817-826 10 p.

  研究成果: Article › 同行評審
  2 引文 斯高帕斯（Scopus）

• Wall stabilization of high beta plasmas in DIII-D

  Taylor, T. S., Strait, E. J., Lao, L., Mauel, M., Turnbull, A. D., Burrell, K. H., Chu, M. S., Ferron, J. R., Groebner, R. J., La Haye, R. J., Rice, B. W., Snider, R. T., Thompson, S. J., Wròblewski, D. & Lightly, D. J., 1995, 於: Physics of Plasmas. 2, 6, p. 2390-2396 7 p.

  研究成果: Article › 同行評審
  14 引文 斯高帕斯（Scopus）

• Wall stresses and platelet adhesion in a T-junction

  Lee, D., Chiu, Y. L. & Jen, C. Y., 1999 3月 1, 於: Proceedings of the National Science Council, Republic of China, Part A: Physical Science and Engineering. 23, 2, p. 303-310 8 p.

  研究成果: Article › 同行評審
  5 引文 斯高帕斯（Scopus）

• Walsh function method of harmonic elimination

  Liang, T-J. & Hoft, R. G., 1993, Conference Procedings - IEEE Applied Power Electronics Conference and Exposition - APEC. Publ by IEEE, p. 847-853 7 p.

  研究成果: Conference contribution
  17 引文 斯高帕斯（Scopus）

• Wandering in A Traditional City of Colonial Taiwan: A Study of Urban Transformation of Taipei, 1895-1945

  貢獻的翻譯標題: 一個港區空間面貌的呈顯—以清領時期「台灣府城五條港區」為例Wu, P-S., 2008 12月, The International Association for the Study of Traditional Environments (IASTE) 11th Conference . Oxford, UK

  研究成果: Conference contribution

• Wand of Power: The Verghetta of Inferno IX

  Scott, C. F., 1990 3月 9, The Seventh Biennial New College Conference on Medieval-Renaissance Studies. Sarasota, Florida

  研究成果: Conference contribution

• Wang Duan: Upper Thai-Malay Peninsula coastal groups during the early and late Neolithic period

  Bellina, B., Petchey, P., Shoocongdej, R., Pradier, B., Favereau, A., Innanchai, J., Castillo, C., Champion, L., Khaokhiew, C. & Hrysiewicz, B., 2022 6月, 於: Archaeological Research in Asia. 30, 100368.

  研究成果: Article › 同行評審

• War comes to the Shore of Brunei: Brunei in World War II

  Dhont, F., 2016 2月, History Symposium in Honour of Associate Professor B.A.Hussainmiya.. University of Brunei Darussalam, Brunei

  研究成果: Conference contribution

• Ward‐Based Nurses’ Knowledge and Attitudes Toward Clinical Trials: A Survey Study in Taiwan

  Kao, C., Hamilton, B., Lin, Y. & Hu, W., 2019 7月 1, 於: Journal of Nursing Scholarship. 51, 4, p. 489-496

  研究成果: Article › 同行評審
  1 引文 斯高帕斯（Scopus）

• Wardrobe Rentals: A Study of the Fashion Industry under Sharing Economy

  Zhang, Y. & Liou, S., 2021, 2021 9th International Conference on Orange Technology, ICOT 2021. Institute of Electrical and Electronics Engineers Inc., (2021 9th International Conference on Orange Technology, ICOT 2021).

  研究成果: Conference contribution

• Warming impact on herbivore population composition affects top-down control by predators

  Wang, Y. J., Nakazawa, T. & Ho, C. K., 2017 12月 1, 於: Scientific reports. 7, 1, 941.

  研究成果: Article › 同行評審

  開啟存取
  6 引文 斯高帕斯（Scopus）

• Warm up, cool down, and tearing apart in NK cell memory

  Wu, L. S. H. & Wang, J. Y., 2018 12月 1, 於: Cellular and Molecular Immunology. 15, 12, p. 1095-1097 3 p.

  研究成果: Comment/debate › 同行評審

  開啟存取
  13 引文 斯高帕斯（Scopus）

• Warm-white light-emitting diode with high color rendering index fabricated by combining trichromatic InGaN emitter with single red phosphor

  Sheu, J. K., Chen, F. B., Wang, Y. C., Chang, C. C., Huang, S. H., Liu, C. N. & Lee, M. L., 2015 4月 6, 於: Optics Express. 23, 7, p. A232-A239

  研究成果: Article › 同行評審
  22 引文 斯高帕斯（Scopus）

• Warpage and residual stress analyses of post-mold cure process of IC packages

  Lin, M. Y., Zeng, Y. J., Hwang, S. J., Wang, M. H., Liu, H. P. & Fang, C. L., 2023 1月, 於: International Journal of Advanced Manufacturing Technology. 124, 3-4, p. 1017-1039 23 p.

  研究成果: Article › 同行評審

  開啟存取

• Warpage evolution of overmolded ball grid array package during post-mold curing thermal process

  Chiu, T. C., Huang, H. W. & Lai, Y. S., 2011 12月, 於: Microelectronics Reliability. 51, 12, p. 2263-2273 11 p.

  研究成果: Article › 同行評審
  19 引文 斯高帕斯（Scopus）

• Warpage prediction and experiments of fan-out waferlevel package during encapsulation process

  Deng, S. S., Hwang, S. J. & Lee, H. H., 2013, 於: IEEE Transactions on Components, Packaging and Manufacturing Technology. 3, 3, p. 452-458 7 p., 6410393.

  研究成果: Article › 同行評審
  57 引文 斯高帕斯（Scopus）

• Warpage simulation for encapsulated package during post-mold curing process

  Huang, H. W., Chiu, T. C. & Lai, Y. S., 2010 12月 1, International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 5699576. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

  研究成果: Conference contribution
  2 引文 斯高帕斯（Scopus）

• Warpage simulation for the reconstituted wafer used in fan-out wafer level packaging

  Chiu, T. C. & Yeh, E. Y., 2018 1月, 於: Microelectronics Reliability. 80, p. 14-23 10 p.

  研究成果: Article › 同行評審
  37 引文 斯高帕斯（Scopus）

• Warpage simulations with P-V-T-C equation and experiments of fan-out wafer level package after encapsulation process

  Deng, S. S., Hwang, S-J., Lee, H-H., Huang, D. Y. & Shen, G. S., 2010 12月 1, International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings. 5699590. (International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings).

  研究成果: Conference contribution
  2 引文 斯高帕斯（Scopus）