尋找研究成果

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已選取的篩選器
2019
Electromigration
electromigration
Intermetallics
intermetallics
Solid solutions
3 引文 (Scopus)
solders
mechanical properties
Soldering alloys
Mechanical properties
elongation
solders
mechanical properties
Soldering alloys
Mechanical properties
Microhardness
Electromigration
Supersaturation
Cathodes
Temperature
Electrodes
2 引文 (Scopus)
solders
Alloying
alloying
mechanical properties
Mechanical properties
solders
Soldering alloys
Intermetallics
intermetallics
shear
2 引文 (Scopus)
solders
Soldering alloys
wetting
Intermetallics
intermetallics
2018
2 引文 (Scopus)
solders
intermetallics
dissolving
electric current
ambient temperature
1 引文 (Scopus)

Crystal Structure Variations of Sn Nanoparticles upon Heating

Mittal, J. & Lin, K-L., 2018 四月 1, 於 : Journal of Electronic Materials. 47, 4, p. 2394-2401 8 p.

研究成果: Article

Crystal structure
Nanoparticles
Heating
nanoparticles
crystal structure
1 引文 (Scopus)
solders
Soldering alloys
Aging of materials
intermetallics
Liquids
5 引文 (Scopus)
solders
Toughness
toughness
mechanical properties
Mechanical properties
3 引文 (Scopus)
Electromigration
electromigration
Intermetallics
intermetallics
Cathodes
2 引文 (Scopus)

The failure mode of Bi and Ni-doped Sn-Ag-Cu solder joint under electromigration tests

Lin, T. C., Kung, H. Y., Lee, S. H., Chen, M. H., Chiu, Y. T. & Lin, K. L., 2018 六月 6, 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018. Institute of Electrical and Electronics Engineers Inc., p. 226-229 4 p. (2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018).

研究成果: Conference contribution

Electromigration
Soldering alloys
Failure modes
Alloying
Nanohardness
1 引文 (Scopus)
solders
Metallizing
Soldering alloys
Intermetallics
intermetallics
12 引文 (Scopus)
Electric currents
electric current
Metals
microstructure
Microstructure
2017
4 引文 (Scopus)
Fluxes
Nanoparticles
nanoparticles
interactions
soldering
3 引文 (Scopus)
Multiwalled carbon nanotubes (MWCN)
Nanotubes
Thermal conductivity
nanotubes
thermal conductivity
2 引文 (Scopus)

Carbon nanotube-based interconnections

Mittal, J. & Lin, K-L., 2017 一月 1, 於 : Journal of Materials Science. 52, 2, p. 643-662 20 p.

研究成果: Review article

Carbon Nanotubes
Carbon nanotubes
2 引文 (Scopus)

Current induced rapid phase transformation in Au/Sn reaction couple

Chiu, T. C. & Lin, K-L., 2017 一月 1, 於 : Journal of Alloys and Compounds. 712, p. 111-120 10 p.

研究成果: Article

Induced currents
Phase transitions
Transmission electron microscopy
X ray spectrometers
Crystals
11 引文 (Scopus)

Current induced segregation of intermetallic compounds in three-dimensional integrated circuit microbumps

Chen, C. W., Chiu, T. C., Chiu, Y. T., Lee, C. W. & Lin, K-L., 2017 六月 1, 於 : Intermetallics. 85, p. 117-124 8 p.

研究成果: Article

Induced currents
Intermetallics
Soldering alloys
Electromigration
Palladium
3 引文 (Scopus)
Growth kinetics
solders
Metallizing
Surface chemistry
Reaction kinetics
1 引文 (Scopus)

Effect of doping element on the interfacial reaction behavior of Ag alloy wires bonding on Al pad after HTST and TCT tests

Lin, Y. W., Su, M. C., Huang, W. H., Chiu, Y. T., Shih, T. P. & Lin, K-L., 2017 二月 21, Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016. Institute of Electrical and Electronics Engineers Inc., p. 613-619 7 p. 7861553. (Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016).

研究成果: Conference contribution

Surface chemistry
Chemical elements
Doping (additives)
Wire
Ions
8 引文 (Scopus)
solders
wettability
Surface chemistry
Soldering alloys
Wetting
1 引文 (Scopus)

Formation of nanojoints between carbon nanotubes and copper nanoparticles

Mittal, J. & Lin, K. L., 2017 一月, 於 : Carbon Letters. 21, 1, p. 86-92 7 p.

研究成果: Comment/debate

2 引文 (Scopus)

Fundamentals of solder alloys in 3D packaging

Lin, K-L., 2017 一月 1, Springer Series in Advanced Microelectronics. Springer Verlag, p. 205-222 18 p. (Springer Series in Advanced Microelectronics; 卷 57).

研究成果: Chapter

Soldering alloys
Packaging
Intermetallics
Networks (circuits)
Substrates
11 引文 (Scopus)

Non-deformation recrystallization of metal with electric current stressing

Liang, P. C. & Lin, K-L., 2017 一月 1, 於 : Journal of Alloys and Compounds. 722, p. 690-697 8 p.

研究成果: Article

Brass
Electric currents
Microhardness
Metals
Refining
1 引文 (Scopus)
Solid state reactions
Soldering alloys
Intermetallics
Dissolution
Liquids

The mechanism of Al contents (0-0.09 wt%) on the wettability and interfacial intermetallic compounds growth of Zn-25Sn/Cu

Niu, X. & Lin, K-L., 2017 九月 19, 18th International Conference on Electronic Packaging Technology, ICEPT 2017. Institute of Electrical and Electronics Engineers Inc., p. 80-88 9 p. 8046412

研究成果: Conference contribution

Soldering alloys
Intermetallics
Wetting
Electron probe microanalysis
Substrates
8 引文 (Scopus)
Acoustic impedance
electrical resistance
Electric currents
Thin films
thin films
2016
9 引文 (Scopus)

Disruption of crystalline structure of Sn3.5Ag induced by electric current

Huang, H. C., Lin, K-L. & Wu, A. T., 2016 三月 21, 於 : Journal of Applied Physics. 119, 11, 115102.

研究成果: Article

electric current
diffraction
solders
matrices
coalescing
7 引文 (Scopus)

Effect of Ti Addition on Early-Stage Wetting Behavior Between Zn-25Sn-xTi Solder and Cu

Huang, W. C. & Lin, K-L., 2016 十二月 1, 於 : Journal of Electronic Materials. 45, 12, p. 6137-6142 6 p.

研究成果: Article

solders
Soldering alloys
wetting
Wetting
Liquids
7 引文 (Scopus)

The corrosion behavior of Ag alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Chiu, Y. T., Chiang, T. H., Yang, P. F., Huang, L., Hung, C. P., Uegaki, S. & Lin, K-L., 2016 六月 7, 2016 International Conference on Electronics Packaging, ICEP 2016. Institute of Electrical and Electronics Engineers Inc., p. 497-501 5 p. 7486877. (2016 International Conference on Electronics Packaging, ICEP 2016).

研究成果: Conference contribution

Chlorine Compounds
Sheet molding compounds
Chlorine
Wire
Corrosion
8 引文 (Scopus)
Intermetallics
intermetallics
voids
Electric currents
Substrates
4 引文 (Scopus)

The Intermetallic Compound Formation for the Wire Bond Between an Al Pad and Ag-xPd Alloy Wire

Huang, W. H., Lin, K-L., Lin, Y. W. & Cheng, Y. K., 2016 十二月 1, 於 : Journal of Electronic Materials. 45, 12, p. 6130-6136 7 p.

研究成果: Article

Intermetallics
intermetallics
wire
Wire
Palladium alloys
9 引文 (Scopus)
solders
Soldering alloys
mechanical properties
Mechanical properties
microstructure
2015
7 引文 (Scopus)

Electro-dissolution of the Bi second phase in Sn5Bi solder alloy

Chiu, T. C., Chiu, Y. T. & Lin, K-L., 2015 十二月 1, 於 : Materials Letters. 160, p. 309-313 5 p.

研究成果: Article

solders
Soldering alloys
dissolving
Dissolution
Supersaturation
11 引文 (Scopus)

Exothermic low temperature sintering of Cu nanoparticles

Mittal, J. & Lin, K-L., 2015 十一月 1, 於 : Materials Characterization. 109, p. 19-24 6 p.

研究成果: Article

sintering
Sintering
Nanoparticles
nanoparticles
Copper
10 引文 (Scopus)

High dislocation density of tin induced by electric current

Liao, Y. H., Liang, C. L., Lin, K. L. & Wu, A. T., 2015 十二月 1, 於 : AIP Advances. 5, 12, 127210.

研究成果: Article

electric current
tin
deflection
refining
strip
13 引文 (Scopus)
Soldering alloys
Wetting
Air
Temperature
Argon

Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints

Liang, C. L., Lin, K. L. & Peng, J. W., 2015 九月 30, (Accepted/In press) 於 : Journal of Electronic Materials.

研究成果: Article

Microstructural evolution
solders
Soldering alloys
Intermetallics
intermetallics
Carbon Nanotubes
Carbon nanotubes
carbon nanotubes
coatings
Coatings

The atomic behavior during heating in the amorphous diffusion nanolayer between Cu and solder

Pan, C. C., Lin, Y. W., Lin, C. I., Mittal, J. & Lin, K-L., 2015 十二月 15, 於 : Journal of Non-Crystalline Solids. 430, p. 38-42 5 p., 17594.

研究成果: Article

solders
Soldering alloys
Heating
heating
atoms
14 引文 (Scopus)

The diminishing of crystal structure of Sn9Zn alloy due to electrical current stressing

He, J. Y., Lin, K-L. & Wu, A. T., 2015 一月 15, 於 : Journal of Alloys and Compounds. 619, p. 372-377 6 p.

研究成果: Article

Crystal structure
X ray diffraction
Crystals
Synchrotrons
Crystal orientation
Supersaturation
solders
supersaturation
Soldering alloys
dissolving
2014
11 引文 (Scopus)
solders
wetting
Wetting
Temperature
air cooling
1 引文 (Scopus)

Intermetallic compound growth mechanism and failure modes of flip chip solder bump with different UBM structure during electromigration

Zou, Y. S., Hsiao, Y. H. & Lin, K-L., 2014 一月 30, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., p. 155-158 4 p. 7028311. (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).

研究成果: Conference contribution

Electromigration
Soldering alloys
Failure modes
Intermetallics
Electric currents
3 引文 (Scopus)

Removed organic solderability preservative (OSPs) by Ar/O2 microwave plasma to improve solder joint in thermal compression flip chip bonding

Peng, J. W., Chen, Y. S., Chen, Y., Liang, J. L., Lin, K-L. & Lee, Y-L., 2014 九月 11, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 1584-1589 6 p. 689750. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

Soldering alloys
Compaction
Microwaves
Plasmas
Scanning electron microscopy
5 引文 (Scopus)

The corrosion performance of Cu alloy wire bond on Al pad in molding compounds of various chlorine contents under biased-HAST

Chiu, Y. T., Chiang, T. H., Chen, Y. F., Yang, P. F., Huang, L. & Lin, K-L., 2014 九月 11, Proceedings - Electronic Components and Technology Conference. Institute of Electrical and Electronics Engineers Inc., p. 419-424 6 p. 6897319. (Proceedings - Electronic Components and Technology Conference).

研究成果: Conference contribution

Chlorine Compounds
Sheet molding compounds
Chlorine
Wire
Corrosion

The IMC formation and progress in the copper pillar Cu/Sn1.8Ag /OSP-Cu microbump structure upon current stressing

Chen, C. W., Lin, K-L., Chiu, Y. T., Kao, C. L., Lee, C. W. & Yang, P. F., 2014 一月 30, Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., p. 518-521 4 p. 7028325. (Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014).

研究成果: Conference contribution

Soldering alloys
Intermetallics
Copper
Electric currents
Current density
3 引文 (Scopus)

The physics of Cu pillar bump interconnect under electromigration stress testing

Hsiao, Y. H., Chen, C. F., Yang, P. F., Lee, C. C., Liu, M. C., Lin, K-L., Chen, C. W. & Factor, B. J., 2014 十一月 18, Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014. Institute of Electrical and Electronics Engineers Inc., 6962759. (Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014).

研究成果: Conference contribution

Electromigration
Soldering alloys
Physics
Testing
Intermetallics