TY - JOUR
T1 - A closed-form delay formula for on-chip RLC interconnects in current-mode signaling
AU - Zhou, Mingcui
AU - Liu, Wentai
AU - Sivaprakasam, Mohanasankar
PY - 2005
Y1 - 2005
N2 - Current-mode signaling significantly increases the bandwidth of on-chip interconnects compared to voltage mode signaling and reduces the overall propagation delay. A delay formula (line and load delay) for current mode is necessary for estimation of delay and bandwidth for VLSI systems. The inductance effect of interconnects is more dominant in sub-micron technology. So a RC approximation results in significant error in delay estimation. This paper presents a closed-form delay formula for on-chip RLC interconnects for current mode signaling. The delay formula reported herein is derived based on the modified nodal analysis (MNA) formulation and an equivalent lumped model representation of inductance effects. Compared to computationally intensive methods, this method results in a simple yet accurate expression by 'absorbing' the inductance into the RC model. The formula is verified via HSPICE simulations and is 5% accuracy over a wide range of interconnect parameters. The accuracy of the expression under different ranges of parameters is discussed, enabling this to be used as design tool.
AB - Current-mode signaling significantly increases the bandwidth of on-chip interconnects compared to voltage mode signaling and reduces the overall propagation delay. A delay formula (line and load delay) for current mode is necessary for estimation of delay and bandwidth for VLSI systems. The inductance effect of interconnects is more dominant in sub-micron technology. So a RC approximation results in significant error in delay estimation. This paper presents a closed-form delay formula for on-chip RLC interconnects for current mode signaling. The delay formula reported herein is derived based on the modified nodal analysis (MNA) formulation and an equivalent lumped model representation of inductance effects. Compared to computationally intensive methods, this method results in a simple yet accurate expression by 'absorbing' the inductance into the RC model. The formula is verified via HSPICE simulations and is 5% accuracy over a wide range of interconnect parameters. The accuracy of the expression under different ranges of parameters is discussed, enabling this to be used as design tool.
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U2 - 10.1109/ISCAS.2005.1464780
DO - 10.1109/ISCAS.2005.1464780
M3 - Conference article
AN - SCOPUS:67649120262
SN - 0271-4310
SP - 1082
EP - 1085
JO - Proceedings - IEEE International Symposium on Circuits and Systems
JF - Proceedings - IEEE International Symposium on Circuits and Systems
M1 - 1464780
T2 - IEEE International Symposium on Circuits and Systems 2005, ISCAS 2005
Y2 - 23 May 2005 through 26 May 2005
ER -