A comparative study of sputtered TaCx and WCx films as diffusion barriers between Cu and Si

Shui Jinn Wang, Hao Yi Tsai, S. C. Sun

研究成果: Article同行評審

11 引文 斯高帕斯(Scopus)

摘要

The barrier properties of sputter-deposited tantalum carbide (TaCx) and tungsten carbide (WCx) for Cu metallization were investigated and compared. The incorporation of the C atom is shown to be effective in decorating local defects of the barrier layer and improving the thermal stability of the Cu/barrier/Si contact system. Owing to a higher melting point and better chemical inertness, with respect to Si substrate, the TaCx (600 Å) film shows a better thermal stability (up to 650°C) than that of WCx (∼600°C) film based on material analyses, while the highest stable temperature as evaluated by the n+ p-diode leakage measurement is found to be approximately 550°C for the TaCx and 500°C for the WCx barrier layer. The failure of the TaCx and WCx barriers is found to be mainly due to Cu diffusion through the localized defects of the barrier layers into the Si substrate. The interfacial reaction between the WCx layer and the Si substrate is found to play an additional role in the failure of the WCx film.

原文English
頁(從 - 到)179-187
頁數9
期刊Thin Solid Films
394
發行號1-2
DOIs
出版狀態Published - 2001 8月 15

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 表面和介面
  • 表面、塗料和薄膜
  • 金屬和合金
  • 材料化學

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