A contact nano-imprinting for direct metal transfer based on infrared pulsed laser heating

研究成果: Conference contribution

1 引文 (Scopus)

摘要

We report the development of a new contact imprinting method which can transfer metallic nano-patterns directly from a silicon mold to a substrate, with the help of an infrared pulse laser heating. This new technique integrates the strengths of both soft imprinting lithography and laser assisted imprinting method. It utilizes a Nd:YAG pulse laser of a wavelength 1064 nm to penetrate and heat up a silicon mold which has a thin metal layer pre-evaporated on its surface. The mold has some nano-scaled features and is pressed against the substrate under a given loading pressure. The high temperature caused by the infrared laser heating and the applied contact pressure can transfer the pre-deposited metal film directly from the silicon mold onto the substrate surface with the pattern defined by the mold. This method has several advantages such as fast transfer speed, no need for photoresist as etching mask, and the availability of nano-scaled silicon molds. Preliminary experiments have been carried out and some encouraging results are obtained.

原文English
主出版物標題Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
頁面792-796
頁數5
DOIs
出版狀態Published - 2007
事件2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 - Bangkok, Thailand
持續時間: 2007 一月 162007 一月 19

Other

Other2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
國家Thailand
城市Bangkok
期間07-01-1607-01-19

指紋

Laser heating
Infrared lasers
Pulsed lasers
Silicon
Metals
Laser pulses
Substrates
Molds
Photoresists
Lithography
Masks
Etching
Availability
Infrared radiation
Wavelength
Lasers
Experiments
Temperature

All Science Journal Classification (ASJC) codes

  • Computer Networks and Communications
  • Computer Science Applications
  • Electrical and Electronic Engineering

引用此文

Chen, C. H., Lee, Y. C., & Hsiao, F. B. (2007). A contact nano-imprinting for direct metal transfer based on infrared pulsed laser heating. 於 Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 (頁 792-796). [4160439] https://doi.org/10.1109/NEMS.2007.352136
Chen, Chun Hung ; Lee, Yung Chun ; Hsiao, Fei Bin. / A contact nano-imprinting for direct metal transfer based on infrared pulsed laser heating. Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007. 2007. 頁 792-796
@inproceedings{64cff43dcfff4a31b8c79e13d517574a,
title = "A contact nano-imprinting for direct metal transfer based on infrared pulsed laser heating",
abstract = "We report the development of a new contact imprinting method which can transfer metallic nano-patterns directly from a silicon mold to a substrate, with the help of an infrared pulse laser heating. This new technique integrates the strengths of both soft imprinting lithography and laser assisted imprinting method. It utilizes a Nd:YAG pulse laser of a wavelength 1064 nm to penetrate and heat up a silicon mold which has a thin metal layer pre-evaporated on its surface. The mold has some nano-scaled features and is pressed against the substrate under a given loading pressure. The high temperature caused by the infrared laser heating and the applied contact pressure can transfer the pre-deposited metal film directly from the silicon mold onto the substrate surface with the pattern defined by the mold. This method has several advantages such as fast transfer speed, no need for photoresist as etching mask, and the availability of nano-scaled silicon molds. Preliminary experiments have been carried out and some encouraging results are obtained.",
author = "Chen, {Chun Hung} and Lee, {Yung Chun} and Hsiao, {Fei Bin}",
year = "2007",
doi = "10.1109/NEMS.2007.352136",
language = "English",
isbn = "1424406102",
pages = "792--796",
booktitle = "Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007",

}

Chen, CH, Lee, YC & Hsiao, FB 2007, A contact nano-imprinting for direct metal transfer based on infrared pulsed laser heating. 於 Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007., 4160439, 頁 792-796, 2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007, Bangkok, Thailand, 07-01-16. https://doi.org/10.1109/NEMS.2007.352136

A contact nano-imprinting for direct metal transfer based on infrared pulsed laser heating. / Chen, Chun Hung; Lee, Yung Chun; Hsiao, Fei Bin.

Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007. 2007. p. 792-796 4160439.

研究成果: Conference contribution

TY - GEN

T1 - A contact nano-imprinting for direct metal transfer based on infrared pulsed laser heating

AU - Chen, Chun Hung

AU - Lee, Yung Chun

AU - Hsiao, Fei Bin

PY - 2007

Y1 - 2007

N2 - We report the development of a new contact imprinting method which can transfer metallic nano-patterns directly from a silicon mold to a substrate, with the help of an infrared pulse laser heating. This new technique integrates the strengths of both soft imprinting lithography and laser assisted imprinting method. It utilizes a Nd:YAG pulse laser of a wavelength 1064 nm to penetrate and heat up a silicon mold which has a thin metal layer pre-evaporated on its surface. The mold has some nano-scaled features and is pressed against the substrate under a given loading pressure. The high temperature caused by the infrared laser heating and the applied contact pressure can transfer the pre-deposited metal film directly from the silicon mold onto the substrate surface with the pattern defined by the mold. This method has several advantages such as fast transfer speed, no need for photoresist as etching mask, and the availability of nano-scaled silicon molds. Preliminary experiments have been carried out and some encouraging results are obtained.

AB - We report the development of a new contact imprinting method which can transfer metallic nano-patterns directly from a silicon mold to a substrate, with the help of an infrared pulse laser heating. This new technique integrates the strengths of both soft imprinting lithography and laser assisted imprinting method. It utilizes a Nd:YAG pulse laser of a wavelength 1064 nm to penetrate and heat up a silicon mold which has a thin metal layer pre-evaporated on its surface. The mold has some nano-scaled features and is pressed against the substrate under a given loading pressure. The high temperature caused by the infrared laser heating and the applied contact pressure can transfer the pre-deposited metal film directly from the silicon mold onto the substrate surface with the pattern defined by the mold. This method has several advantages such as fast transfer speed, no need for photoresist as etching mask, and the availability of nano-scaled silicon molds. Preliminary experiments have been carried out and some encouraging results are obtained.

UR - http://www.scopus.com/inward/record.url?scp=34548143338&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=34548143338&partnerID=8YFLogxK

U2 - 10.1109/NEMS.2007.352136

DO - 10.1109/NEMS.2007.352136

M3 - Conference contribution

AN - SCOPUS:34548143338

SN - 1424406102

SN - 9781424406104

SP - 792

EP - 796

BT - Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007

ER -

Chen CH, Lee YC, Hsiao FB. A contact nano-imprinting for direct metal transfer based on infrared pulsed laser heating. 於 Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007. 2007. p. 792-796. 4160439 https://doi.org/10.1109/NEMS.2007.352136