A Critical Review on the Electromigration Effect, the Electroplastic Effect, and Perspectives on the Effects of Electric Current Upon Alloy Phase Stability

Yu chen Liu, Shih kang Lin

研究成果: Review article

摘要

The electronic interconnections in the state-of-the-art integrated circuit manufacturing have been scaled down to the micron or sub-micron scale. This results in a dramatic increase in the current density passing through interconnections, which means that the electromigration (EM) effect plays a significant role in the reliability of products. Although thorough studies and reviews of EM effects have been continuously conducted in the past 60 years, some parts of EM theories lack clear elucidation of the electric current-induced non-directional effects, including electric current-induced phase equilibrium changes. This review article is intended to provide a broad picture of electric current-induced lattice stability changes and to summarize the existing literature on EM-related phenomena, EM-related theoretical models, and relevant effects of the electroplastic (EP) effect in order to lead to a better understanding of electric current-induced effects on materials. This article also posits that EM is either part of the EP effect or shares the intrinsic electric current-induced plastic deformation associated with the EP effect. This concept appears to contribute to the missing parts of the EM theories.

原文English
頁(從 - 到)3094-3106
頁數13
期刊JOM
71
發行號9
DOIs
出版狀態Published - 2019 九月 15

指紋

Phase stability
Electromigration
Electric currents
Phase equilibria
Integrated circuits
Plastic deformation
Current density

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Engineering(all)

引用此文

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