A current-mode buck converter with bandwidth reconfigurable for enhanced efficiency and improved load transient response

Pai Yi Wang, Li Te Wu, Tai Haur Kuo

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

Current-mode control is commonly used in buck converters. Many current-mode buck converters with variable-frequency controllers have been published for smaller inductance and maintaining efficiency via fast and slow frequency, respectively. However, bandwidth of the current-mode buck converter with fixed compensation coefficients is limited by the lowest switching frequency, thus decreases transient speed. This paper proposes a current-mode buck converter with reconfigurable compensation coefficients controlled by a switched-capacitor compensator and activated by a transient detector. Fabricated in 0.35μm CMOS process, this chip occupying 0.91mm2 achieves 96.3% peak efficiency. A 5μs settling time is measured with 75mV undershoot for 700mA load transition.

原文English
主出版物標題2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers
發行者Institute of Electrical and Electronics Engineers Inc.
頁面69-72
頁數4
ISBN(電子)9781479940905
DOIs
出版狀態Published - 2015 一月 13
事件2014 10th IEEE Asian Solid-State Circuits Conference, A-SSCC 2014 - Kaohsiung, Taiwan
持續時間: 2014 十一月 102014 十一月 12

出版系列

名字2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers

Conference

Conference2014 10th IEEE Asian Solid-State Circuits Conference, A-SSCC 2014
國家Taiwan
城市Kaohsiung
期間14-11-1014-11-12

    指紋

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Hardware and Architecture

引用此

Wang, P. Y., Wu, L. T., & Kuo, T. H. (2015). A current-mode buck converter with bandwidth reconfigurable for enhanced efficiency and improved load transient response. 於 2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers (頁 69-72). [7008862] (2014 IEEE Asian Solid-State Circuits Conference, A-SSCC - Proceedings of Technical Papers). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ASSCC.2014.7008862