A Cyclic-Softening Viscoplastic Model for Considering the Temperature-Cycling Reliability of SAC305 Solder Joints

Hung Chun Yang, Tz Cheng Chiu

研究成果: Conference contribution

摘要

A novel viscoplastic model was developed for simulating the constitutive behavior of SAC305 (Sn3.0Ag0.5Cu) solder. The model incorporates dynamic recovery functions in the kinematic hardening rule for modeling the cyclic-softening behavior of the solder. The unified viscoplastic model was discretized by following the backward Euler integration scheme and implemented as a user-defined material subroutine (USERMAT) in ANSYS. Validation of the numerical model was conducted by simulating the solder rod responses under either strain-or stress-controlled cycling and compared to experimental measurements. It was shown that the numerical simulation is capable of predicting the softening response under cyclic straining and the ratcheting response under cyclic stressing. An ANSYS model for wafer-level package (WLP) under board-level temperature cyclic condition was also developed to simulate the ball grid array (BGA) solder joint response. From the simulation, the viscoplastic strain energy density accumulation over one temperature cycle was identified as a feasible parameter for evaluating the thermomechanical reliability of the of solder joints in electronic assembly.

原文English
主出版物標題International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Proceedings
發行者IEEE Computer Society
頁面157-160
頁數4
ISBN(電子)9781728198514
DOIs
出版狀態Published - 2020 十月 21
事件15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020 - Taipei, Taiwan
持續時間: 2020 十月 212020 十月 23

出版系列

名字Proceedings of Technical Papers - International Microsystems, Packaging, Assembly, and Circuits Technology Conference, IMPACT
2020-October
ISSN(列印)2150-5934
ISSN(電子)2150-5942

Conference

Conference15th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2020 and 22nd International Conference on Electronics Materials and Packaging, EMAP 2020
國家Taiwan
城市Taipei
期間20-10-2120-10-23

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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