A Decision Tree-Based Screening Method for Improving Test Quality of Memory Chips

Ya Chi Cheng, Pai Yu Tan, Cheng Wen Wu, Ming Der Shieh, Chien Hui Chuang, Gordon Liao

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

There is a growing demand for high-reliability and high-quality integrated circuit (IC) products, while their test costs should be kept as low as possible. We investigate the test process of advanced memory chips, where the high temperature operating life (HTOL) test has been used to determine their intrinsic reliability. This high temperature sampling test can run from 168 to 1,000 hours, so it is time-consuming and expensive. Recently, machine learning (ML) algorithms have been used to solve classification problems, so far as good training data can be obtained. In our case, there is already a large amount of parametric test data generated from the existing test flow. Therefore, in this work, we propose a decision tree (DT)-based screening method to predict weak (unreliable) dies that would fail the HTOL test. We show that experienced test engineers can prioritize the parametric test data for better use of the DT model. Finally, we take advantage of the high interpretability of DT to develop the multi-feature heuristics, which can be used to improve the quality of final test (FT). Keeping the overkill rate at 0%, our heuristics can screen out 25% more bad dies, i.e., we can improve the FT quality without additional cost.

原文English
主出版物標題Proceedings - 2022 IEEE International Test Conference in Asia, ITC-Asia 2022
發行者Institute of Electrical and Electronics Engineers Inc.
頁面19-24
頁數6
ISBN(電子)9781665455237
DOIs
出版狀態Published - 2022
事件6th IEEE International Test Conference in Asia, ITC-Asia 2022 - Taipei, Taiwan
持續時間: 2022 8月 242022 8月 26

出版系列

名字Proceedings - 2022 IEEE International Test Conference in Asia, ITC-Asia 2022

Conference

Conference6th IEEE International Test Conference in Asia, ITC-Asia 2022
國家/地區Taiwan
城市Taipei
期間22-08-2422-08-26

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 電氣與電子工程
  • 安全、風險、可靠性和品質

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