A fast thermal-aware fixed-outline floorplanning methodology based on analytical models

Jai Ming Lin, Tai Ting Chen, Yen Fu Chang, Wei Yi Chang, Ya Ting Shyu, Yeong Jar Chang, Juin Ming Lu

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)

摘要

High temperature or temperature non-uniformity have become a serious threat to performance and reliability of high-performance integrated circuits (ICs). Thermal effect becomes a non-ignorable issue to circuit design or physical design. To estimate temperature accurately, the locations of modules have to be determined, which makes an efficient and effective thermal-aware floorplanning play a more important role. To resolve this problem, this paper proposes a differential nonlinear model which can approximate temperature and minimize wirelength at the same time during floorplanning. We also apply some techniques such a thermal-aware clustering or shrinking hot modules in the multi-level framework to further reduce temperature without inducing longer wirelength. The experimental results demonstrate that temperature and wirelength are greatly improved in our method compared to other works. More importantly, our runtime is quite fast and the fixed-outline constraint is also satisfied.

原文English
主出版物標題2018 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - Digest of Technical Papers
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781450359504
DOIs
出版狀態Published - 2018 十一月 5
事件37th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018 - San Diego, United States
持續時間: 2018 十一月 52018 十一月 8

出版系列

名字IEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
ISSN(列印)1092-3152

Other

Other37th IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2018
國家United States
城市San Diego
期間18-11-0518-11-08

All Science Journal Classification (ASJC) codes

  • Software
  • Computer Science Applications
  • Computer Graphics and Computer-Aided Design

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