TY - JOUR
T1 - A hybrid surface modification method on copper wire braids for enhancing thermal performance of ultra-thin heat pipes
AU - Sheng, W. K.
AU - Lin, H. T.
AU - Wu, C. H.
AU - Kuo, L. S.
AU - Chen, P. H.
N1 - Funding Information:
The authors would like to thank the assistance for the SEM images from Prof. Chao-Sung Lin, Department of Material Science and Engineering, National Taiwan University. The financial support is from the Ministry of Science and Technology, Taiwan, ROC, under the grant numbers: 105-2221-E-002-107-MY3, 104-2218-E-002-004, 102-2221-E-002-133-MY3, and 102-2218-E-002-022.
Publisher Copyright:
© Published under licence by IOP Publishing Ltd.
PY - 2017/2/15
Y1 - 2017/2/15
N2 - Copper is the most widely used material in heat pipe manufacturing. Since the capability of wick structures inside a heat pipe will dominate its thermal performance, in this study, we introduce a hybrid surface modification method on the copper wire braids being inserted as wick structure into an ultra-thin heat pipe. The hybrid method is the combination of a chemical-oxidation-based method and a sol-gel method with nanoparticles being dip-coated onto the braid. The experimental data show that braids under hybrid treatment perform higher water rising speed than the oxidized braids while owning higher water net weight than those braids being only dip-coated with nanoparticle.
AB - Copper is the most widely used material in heat pipe manufacturing. Since the capability of wick structures inside a heat pipe will dominate its thermal performance, in this study, we introduce a hybrid surface modification method on the copper wire braids being inserted as wick structure into an ultra-thin heat pipe. The hybrid method is the combination of a chemical-oxidation-based method and a sol-gel method with nanoparticles being dip-coated onto the braid. The experimental data show that braids under hybrid treatment perform higher water rising speed than the oxidized braids while owning higher water net weight than those braids being only dip-coated with nanoparticle.
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U2 - 10.1088/1757-899X/175/1/012023
DO - 10.1088/1757-899X/175/1/012023
M3 - Conference article
AN - SCOPUS:85016509394
SN - 1757-8981
VL - 175
JO - IOP Conference Series: Materials Science and Engineering
JF - IOP Conference Series: Materials Science and Engineering
IS - 1
M1 - 012023
T2 - 4th International Conference on Competitive Materials and Technology Processes, IC-CMTP 2016
Y2 - 3 October 2016 through 7 October 2016
ER -