A low temperature co-fired ceramic burner for studying micro flames

M. H. Wu, R. A. Yetter, V. Yang

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

A micro stagnation-point flow burner was fabricated using low temperature co-fired ceramic tapes (LTCC) to study counterflow diffusion flames. Methane/oxygen diffusion flames with luminous zones of less than 1 mm in length and 250 μm in width were stabilized in the burner reaction channel. The burner was built with 25 layers of LTCC tapes that were pre-laminted into 7 blocks. Integrated sapphire windows and sub-millimeter sized internal channels provide optical accessibility and reactant feeds, respectively. Optical diagnostics of micro diffusion flames were implemented using microscopic imaging spectroscopy. One-dimensional spatial distributions of CH* and C 2 * species across micro diffusion flames were measured and compared with numerical solutions. Results show that the location of the CH* emission maximum evolved linearly with the oxygen flow rate when the fuel flow rate was fixed. A quasi-linear C2 */CH* decrease towards the oxidizer size was found across the micro diffusion flame. The experimentally resolved flame structures were in agreement with the contours obtained from the three dimensional numerical simulation. The study successfully demonstrated the feasibility of utilizing LTCC tapes to fabricate microburners for homoegeneous gaseous combustion. In addition to the current application for studying micro flame dynamics, the burner can be applied to microthrusters, micro fuel reformers, in situ toxic incinerators, etc.

原文English
主出版物標題International Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007
頁面359-366
頁數8
出版狀態Published - 2007 十二月 1
事件3rd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007 - Denver, CO, United States
持續時間: 2007 四月 232007 四月 26

出版系列

名字International Microelectronics and Packaging Society - 3rd IMAPS/ACerS International Conference and Exhibition on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007

Other

Other3rd International Conference on Ceramic Interconnect and Ceramic Microsystems Technologies, CICMT 2007
國家United States
城市Denver, CO
期間07-04-2307-04-26

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Ceramics and Composites

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