A Mechanics Model for the Moisture Induced Delamination in Fan-Out Wafer-Level Package

Tz Cheng Chiu, Ji Yen Wu, Wei Te Liu, Chang Wei Liu, Dao Long Chen, Meng Kai Shih, David Tarng

研究成果: Conference contribution

摘要

The effect of moisture absorption on the risk of interface delamination in a fan-out (FO) wafer level package (WLP) was investigated by using experimental and numerical analyses. A double-cantilever-beam (DCB) fracture mechanics test was applied to quantify the degradation of interfacial debonding resistance due to moisture exposure. The driving forces of delamination on various interfaces in the FO WLP were evaluated by using a coupled hygro-thermo-mechanical model. The moisture diffusion related material models such as diffusivity, saturation concentration and the hygroscopic swelling of the polymer constituents in the FO package were characterized experimentally and implemented in the numerical stress model. The numerical model was applied to evaluate the transient stress evolutions at critical locations around the corners of the Si die during moisture sensitivity tests. It was observed that the moisture absorption degrades adhesion significantly. It also leads to a change in stress state around the corners of Si die from compression to tension, and as a result, significantly increase the risk of delamination.

原文English
主出版物標題Proceedings - IEEE 70th Electronic Components and Technology Conference, ECTC 2020
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1205-1211
頁數7
ISBN(電子)9781728161808
DOIs
出版狀態Published - 2020 六月
事件70th IEEE Electronic Components and Technology Conference, ECTC 2020 - Orlando, United States
持續時間: 2020 六月 32020 六月 30

出版系列

名字Proceedings - Electronic Components and Technology Conference
2020-June
ISSN(列印)0569-5503

Conference

Conference70th IEEE Electronic Components and Technology Conference, ECTC 2020
國家United States
城市Orlando
期間20-06-0320-06-30

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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