A miniature heat-dissipation packaging design for gainp collector-up hbts as high-power amplifiers in cellular phone systems

Hsien Cheng Tseng, Pei Hsuan Lee, Jung Hua Chou

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

A heat-dissipation packaging configuration of GalnP collector-up (C-up) heterojunction bipolar transistors (HBTs) has been designed and evaluated systematically. 2-D and 3-D finite-element modeling (FEM) approaches are built up to simulate the actual devices and to analyze the temperature distribution behavior. The results show that the reported configuration can be further reduced by 42%. Therefore, thinning the thermal-via structure constructed in GalnP collector-up HBTs should be useful for miniaturization of high-power amplifier (HPA) designs, and the developed FEM method can be very effective for optimizing HBT-based HPAs in future cellular phone systems.

原文English
主出版物標題2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008
頁面364-366
頁數3
DOIs
出版狀態Published - 2008 十二月 1
事件2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008 - Taipei, Taiwan
持續時間: 2008 十月 222008 十月 24

出版系列

名字2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008

Other

Other2008 3rd International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2008
國家Taiwan
城市Taipei
期間08-10-2208-10-24

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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