A neurofuzzy-based quality-control system for fine pitch stencil printing process in surface mount assembly

Taho Yang, Tsung Nan Tsai

研究成果: Article同行評審

7 引文 斯高帕斯(Scopus)

摘要

Surface mount assembly defect problems can cause significant production-time losses. About 60% of surface mount assembly defects can be attributed to the solder paste stencil printing process. This paper proposes a neurofuzzy-based quality-control system for the fine pitch stencil printing process. The neurofuzzy approach is used to model the nonlinear behavior of the stencil printing process. Eight control variables are defined for process planning and control, including stencil thickness, component pitch, aperture area, snap-off height, squeegee speed, squeegee pressure, solder paste viscosity, and solder paste particle size. The response variables are the volume and height of solder paste deposited. The values of the response variables provide indicators for identifying potential quality problems. A 38-3 fractional factorial experimental design is conducted to collect structured data to augment those collected from the production line for neurofuzzy learning and modeling. Visual basic programming language is then used for both rule retrieval and graphical-user-interface modeling. The effectiveness of the proposed system is illustrated through a real-world application.

原文English
頁(從 - 到)711-721
頁數11
期刊Journal of Intelligent Manufacturing
15
發行號5
DOIs
出版狀態Published - 2004 10月

All Science Journal Classification (ASJC) codes

  • 軟體
  • 工業與製造工程
  • 人工智慧

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