A new method for paper porosity estimation

Cheng Hao Ku, Ruey Jen Yang

研究成果: Conference contribution

摘要

A method is proposed for estimating the porosity of paper by comparing the electric current passing through a wax-printed channel patterned on the paper surface with that passing through a hollow PDMS channel. To ensure the accuracy of the estimation results, the paper channel is sandwiched between two flat polydimethylsiloxane (PDMS) plates in order to minimize evaporation losses and to emulate the surface condition of the hollow PDMS channel used for reference purposes, a good agreement is observed between the estimated values of the paper porosity and the porosity values determined from the basis weight and thickness data provided by the paper manufacturer. The proposed method provides a low-cost and effective means of evaluating candidate materials for microfluidic paperbased analytical devices (μPADs).

原文English
主出版物標題TechConnect Briefs 2018 - Biotech, Biomaterials and Biomedical
編輯Bart Romanowicz, Fiona Case, Fiona Case, Matthew Laudon
發行者TechConnect
頁面194-197
頁數4
ISBN(電子)9780998878249
出版狀態Published - 2018 一月 1
事件11th Annual TechConnect World Innovation Conference and Expo, Held Jointly with the 20th Annual Nanotech Conference and Expo,the 2018 SBIR/STTR Spring Innovation Conference, and the Defense TechConnect DTC Spring Conference - Anaheim, United States
持續時間: 2018 五月 132018 五月 16

出版系列

名字TechConnect Briefs 2018 - Advanced Materials
3

Other

Other11th Annual TechConnect World Innovation Conference and Expo, Held Jointly with the 20th Annual Nanotech Conference and Expo,the 2018 SBIR/STTR Spring Innovation Conference, and the Defense TechConnect DTC Spring Conference
國家United States
城市Anaheim
期間18-05-1318-05-16

    指紋

All Science Journal Classification (ASJC) codes

  • Materials Science(all)

引用此

Ku, C. H., & Yang, R. J. (2018). A new method for paper porosity estimation. 於 B. Romanowicz, F. Case, F. Case, & M. Laudon (編輯), TechConnect Briefs 2018 - Biotech, Biomaterials and Biomedical (頁 194-197). (TechConnect Briefs 2018 - Advanced Materials; 卷 3). TechConnect.