摘要
This paper presents a new nanoimprint method based on the Contact Transfer and Mask Embedded Lithography (CMEL) technique. In CMEL process, a thin metal film is deposited on the silicon mold treated with an anti-adhesion layer. The mold contacts with a liquid phase of PMMA layer on the silicon substrate by applying a uniform pressure on the both sides of the mold and the substrate. After removing the mold, the thin film is embedded onto the PMMA resist as an etching mask for the sub-sequential etching process. In the results of experiments, CMEL has demonstrated the linear grating and dot-array with the feature size around 200 to 500 nm successfully. Compared with other nanoimpint methods, CMEL is a "Green" nanoimprint technique because its process is simple and consumes no energy to assist the mold to form the nanostructures.
| 原文 | English |
|---|---|
| 主出版物標題 | 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 |
| 頁面 | 239-242 |
| 頁數 | 4 |
| DOIs | |
| 出版狀態 | Published - 2008 九月 1 |
| 事件 | 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 - Sanya, China 持續時間: 2008 一月 6 → 2008 一月 9 |
出版系列
| 名字 | 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS |
|---|
Other
| Other | 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008 |
|---|---|
| 國家 | China |
| 城市 | Sanya |
| 期間 | 08-01-06 → 08-01-09 |
指紋
All Science Journal Classification (ASJC) codes
- Control and Systems Engineering
- Electrical and Electronic Engineering
引用此文
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A new micro/nano-Lithography based on contact transfer of thin film and Mask Embedded Lithography. / Lee, Yung Chun; Chiu, Cheng Yu; Chang, Shuo Hung.
3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008. 2008. p. 239-242 4484326 (3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS).研究成果: Conference contribution
TY - GEN
T1 - A new micro/nano-Lithography based on contact transfer of thin film and Mask Embedded Lithography
AU - Lee, Yung Chun
AU - Chiu, Cheng Yu
AU - Chang, Shuo Hung
PY - 2008/9/1
Y1 - 2008/9/1
N2 - This paper presents a new nanoimprint method based on the Contact Transfer and Mask Embedded Lithography (CMEL) technique. In CMEL process, a thin metal film is deposited on the silicon mold treated with an anti-adhesion layer. The mold contacts with a liquid phase of PMMA layer on the silicon substrate by applying a uniform pressure on the both sides of the mold and the substrate. After removing the mold, the thin film is embedded onto the PMMA resist as an etching mask for the sub-sequential etching process. In the results of experiments, CMEL has demonstrated the linear grating and dot-array with the feature size around 200 to 500 nm successfully. Compared with other nanoimpint methods, CMEL is a "Green" nanoimprint technique because its process is simple and consumes no energy to assist the mold to form the nanostructures.
AB - This paper presents a new nanoimprint method based on the Contact Transfer and Mask Embedded Lithography (CMEL) technique. In CMEL process, a thin metal film is deposited on the silicon mold treated with an anti-adhesion layer. The mold contacts with a liquid phase of PMMA layer on the silicon substrate by applying a uniform pressure on the both sides of the mold and the substrate. After removing the mold, the thin film is embedded onto the PMMA resist as an etching mask for the sub-sequential etching process. In the results of experiments, CMEL has demonstrated the linear grating and dot-array with the feature size around 200 to 500 nm successfully. Compared with other nanoimpint methods, CMEL is a "Green" nanoimprint technique because its process is simple and consumes no energy to assist the mold to form the nanostructures.
UR - http://www.scopus.com/inward/record.url?scp=50249122779&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=50249122779&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2008.4484326
DO - 10.1109/NEMS.2008.4484326
M3 - Conference contribution
AN - SCOPUS:50249122779
SN - 9781424419081
T3 - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS
SP - 239
EP - 242
BT - 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2008
ER -