@inproceedings{e19b1a61353a4ccc8ed3763efe57fbec,
title = "A new technique for creating curved interior holes on ultrathin glass based on picosecond laser drilling and thermo-shock separation",
abstract = "Flawless glass cutting is traditional important task for related applications ranged from large scale window application to small scale mobile display device assembly. Recently, the cutting of strengthened glass becomes critical due to their residual tensile stress. This paper describes a novel technique for dealing cutting inner holes and separation of strengthened ultrathin glass for the display unit of mobile communication and computational devices. This method integrates the picosecond laser ablation with quenching induced thermo-shock for accomplishing such a task. Experimental results indicate that the proposed method could achieve successful separations for various enclosed shapes with the surface roughness satisfying the requirement. However, temperature control is critical. Currently, the associated thermo- mechanical finite element analyses are conducted for optimizing the process design.",
author = "Chuang, {C. F.} and Chen, {K. S.}",
note = "Funding Information: ACKNOWLEDGMENT This work is supported by the Ministry of Science and Technology of Taiwan and ITRI through Grant No: MOST 105-2221-E-006-074-MY3. The assistance and discussion from Mr. Mougi Lin of ITRI and Professors T-S Yang and T-Z Chiu from NCKU are greatly appreciated. Publisher Copyright: {\textcopyright} 2018 IEEE.; 20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2018 ; Conference date: 22-05-2018 Through 25-05-2018",
year = "2018",
month = jun,
day = "22",
doi = "10.1109/DTIP.2018.8394207",
language = "English",
series = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "1--5",
editor = "Romolo Marcelli and Yoshio Mita and Stewart Smith and Francis Pressecq and Pascal Nouet and Frederick Mailly and Peter Schneider",
booktitle = "Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018",
address = "United States",
}