A new technique for creating curved interior holes on ultrathin glass based on picosecond laser drilling and thermo-shock separation

C. F. Chuang, K. S. Chen

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

Flawless glass cutting is traditional important task for related applications ranged from large scale window application to small scale mobile display device assembly. Recently, the cutting of strengthened glass becomes critical due to their residual tensile stress. This paper describes a novel technique for dealing cutting inner holes and separation of strengthened ultrathin glass for the display unit of mobile communication and computational devices. This method integrates the picosecond laser ablation with quenching induced thermo-shock for accomplishing such a task. Experimental results indicate that the proposed method could achieve successful separations for various enclosed shapes with the surface roughness satisfying the requirement. However, temperature control is critical. Currently, the associated thermo- mechanical finite element analyses are conducted for optimizing the process design.

原文English
主出版物標題Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018
編輯Romolo Marcelli, Yoshio Mita, Stewart Smith, Francis Pressecq, Pascal Nouet, Frederick Mailly, Peter Schneider
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1-5
頁數5
ISBN(電子)9781538661994
DOIs
出版狀態Published - 2018 六月 22
事件20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2018 - Roma, Italy
持續時間: 2018 五月 222018 五月 25

出版系列

名字Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018

Other

Other20th Symposium on Design, Test, Integration and Packaging of MEMS and MOEMS, DTIP 2018
國家Italy
城市Roma
期間18-05-2218-05-25

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering
  • Mechanical Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials
  • Instrumentation

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  • 引用此

    Chuang, C. F., & Chen, K. S. (2018). A new technique for creating curved interior holes on ultrathin glass based on picosecond laser drilling and thermo-shock separation. 於 R. Marcelli, Y. Mita, S. Smith, F. Pressecq, P. Nouet, F. Mailly, & P. Schneider (編輯), Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018 (頁 1-5). (Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2018). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/DTIP.2018.8394207