A novel back scattering ultrasound transducer for non-destructive material evaluation and defect inspection

Cheng Hsien Chung, Yung-Chun Lee, Shih Hoa Kuo, Chu Lin Chiu

研究成果: Conference contribution

1 引文 (Scopus)

摘要

This research proposes a new type of focusing ultrasound transducer called Analytical Back Scattering Arrayed Ultrasound Transducer (ABSAUT). Different to the conventional focusing ultrasound transducer, an additional PVDF film with patterned electrodes is attached to the concave spherical surface for collecting back scattered ultrasound. It is designed for detecting and characterizing internal defects of a sample in an analytic and quantitative way via multiple back scattering ultrasound signals collection. Standard testing including pulse echo, transducer defocusing testing and sound field scanning are carried out and all the information is recorded for performance verification. Furthermore, a powerful angular spectrum algorithm is involved in the study for time-domain waveform prediction measured by the PVDF sensing elements. In this work, we have proved that ABSAUT can collect the reflected or back scattering sound wave information from the sample under testing. And the time-domain waveform predicted by angular spectrum algorithm also shows good agreement with the data measured by PVDF sensing elements. Finally, future improvements and applications of the ABSAUT will be addressed.

原文English
主出版物標題2005 IEEE Ultrasonics Symposium
頁面174-177
頁數4
DOIs
出版狀態Published - 2005 十二月 1
事件2005 IEEE Ultrasonics Symposium - Rotterdam, Netherlands
持續時間: 2005 九月 182005 九月 21

出版系列

名字Proceedings - IEEE Ultrasonics Symposium
1
ISSN(列印)1051-0117

Other

Other2005 IEEE Ultrasonics Symposium
國家Netherlands
城市Rotterdam
期間05-09-1805-09-21

指紋

Transducers
Inspection
Ultrasonics
Scattering
Defects
Testing
Acoustic fields
Acoustic waves
Scanning
Electrodes

All Science Journal Classification (ASJC) codes

  • Acoustics and Ultrasonics

引用此文

Chung, C. H., Lee, Y-C., Kuo, S. H., & Chiu, C. L. (2005). A novel back scattering ultrasound transducer for non-destructive material evaluation and defect inspection. 於 2005 IEEE Ultrasonics Symposium (頁 174-177). [1602824] (Proceedings - IEEE Ultrasonics Symposium; 卷 1). https://doi.org/10.1109/ULTSYM.2005.1602824
Chung, Cheng Hsien ; Lee, Yung-Chun ; Kuo, Shih Hoa ; Chiu, Chu Lin. / A novel back scattering ultrasound transducer for non-destructive material evaluation and defect inspection. 2005 IEEE Ultrasonics Symposium. 2005. 頁 174-177 (Proceedings - IEEE Ultrasonics Symposium).
@inproceedings{379a9717f84b4ded98a3d5badb9a5d64,
title = "A novel back scattering ultrasound transducer for non-destructive material evaluation and defect inspection",
abstract = "This research proposes a new type of focusing ultrasound transducer called Analytical Back Scattering Arrayed Ultrasound Transducer (ABSAUT). Different to the conventional focusing ultrasound transducer, an additional PVDF film with patterned electrodes is attached to the concave spherical surface for collecting back scattered ultrasound. It is designed for detecting and characterizing internal defects of a sample in an analytic and quantitative way via multiple back scattering ultrasound signals collection. Standard testing including pulse echo, transducer defocusing testing and sound field scanning are carried out and all the information is recorded for performance verification. Furthermore, a powerful angular spectrum algorithm is involved in the study for time-domain waveform prediction measured by the PVDF sensing elements. In this work, we have proved that ABSAUT can collect the reflected or back scattering sound wave information from the sample under testing. And the time-domain waveform predicted by angular spectrum algorithm also shows good agreement with the data measured by PVDF sensing elements. Finally, future improvements and applications of the ABSAUT will be addressed.",
author = "Chung, {Cheng Hsien} and Yung-Chun Lee and Kuo, {Shih Hoa} and Chiu, {Chu Lin}",
year = "2005",
month = "12",
day = "1",
doi = "10.1109/ULTSYM.2005.1602824",
language = "English",
isbn = "0780393821",
series = "Proceedings - IEEE Ultrasonics Symposium",
pages = "174--177",
booktitle = "2005 IEEE Ultrasonics Symposium",

}

Chung, CH, Lee, Y-C, Kuo, SH & Chiu, CL 2005, A novel back scattering ultrasound transducer for non-destructive material evaluation and defect inspection. 於 2005 IEEE Ultrasonics Symposium., 1602824, Proceedings - IEEE Ultrasonics Symposium, 卷 1, 頁 174-177, 2005 IEEE Ultrasonics Symposium, Rotterdam, Netherlands, 05-09-18. https://doi.org/10.1109/ULTSYM.2005.1602824

A novel back scattering ultrasound transducer for non-destructive material evaluation and defect inspection. / Chung, Cheng Hsien; Lee, Yung-Chun; Kuo, Shih Hoa; Chiu, Chu Lin.

2005 IEEE Ultrasonics Symposium. 2005. p. 174-177 1602824 (Proceedings - IEEE Ultrasonics Symposium; 卷 1).

研究成果: Conference contribution

TY - GEN

T1 - A novel back scattering ultrasound transducer for non-destructive material evaluation and defect inspection

AU - Chung, Cheng Hsien

AU - Lee, Yung-Chun

AU - Kuo, Shih Hoa

AU - Chiu, Chu Lin

PY - 2005/12/1

Y1 - 2005/12/1

N2 - This research proposes a new type of focusing ultrasound transducer called Analytical Back Scattering Arrayed Ultrasound Transducer (ABSAUT). Different to the conventional focusing ultrasound transducer, an additional PVDF film with patterned electrodes is attached to the concave spherical surface for collecting back scattered ultrasound. It is designed for detecting and characterizing internal defects of a sample in an analytic and quantitative way via multiple back scattering ultrasound signals collection. Standard testing including pulse echo, transducer defocusing testing and sound field scanning are carried out and all the information is recorded for performance verification. Furthermore, a powerful angular spectrum algorithm is involved in the study for time-domain waveform prediction measured by the PVDF sensing elements. In this work, we have proved that ABSAUT can collect the reflected or back scattering sound wave information from the sample under testing. And the time-domain waveform predicted by angular spectrum algorithm also shows good agreement with the data measured by PVDF sensing elements. Finally, future improvements and applications of the ABSAUT will be addressed.

AB - This research proposes a new type of focusing ultrasound transducer called Analytical Back Scattering Arrayed Ultrasound Transducer (ABSAUT). Different to the conventional focusing ultrasound transducer, an additional PVDF film with patterned electrodes is attached to the concave spherical surface for collecting back scattered ultrasound. It is designed for detecting and characterizing internal defects of a sample in an analytic and quantitative way via multiple back scattering ultrasound signals collection. Standard testing including pulse echo, transducer defocusing testing and sound field scanning are carried out and all the information is recorded for performance verification. Furthermore, a powerful angular spectrum algorithm is involved in the study for time-domain waveform prediction measured by the PVDF sensing elements. In this work, we have proved that ABSAUT can collect the reflected or back scattering sound wave information from the sample under testing. And the time-domain waveform predicted by angular spectrum algorithm also shows good agreement with the data measured by PVDF sensing elements. Finally, future improvements and applications of the ABSAUT will be addressed.

UR - http://www.scopus.com/inward/record.url?scp=33847110630&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=33847110630&partnerID=8YFLogxK

U2 - 10.1109/ULTSYM.2005.1602824

DO - 10.1109/ULTSYM.2005.1602824

M3 - Conference contribution

AN - SCOPUS:33847110630

SN - 0780393821

SN - 9780780393820

T3 - Proceedings - IEEE Ultrasonics Symposium

SP - 174

EP - 177

BT - 2005 IEEE Ultrasonics Symposium

ER -

Chung CH, Lee Y-C, Kuo SH, Chiu CL. A novel back scattering ultrasound transducer for non-destructive material evaluation and defect inspection. 於 2005 IEEE Ultrasonics Symposium. 2005. p. 174-177. 1602824. (Proceedings - IEEE Ultrasonics Symposium). https://doi.org/10.1109/ULTSYM.2005.1602824