A novel back scattering ultrasound transducer for non-destructive material evaluation

Cheng Hsien Chung, Yung-Chun Lee

研究成果: Conference contribution

摘要

this research proposes a new type of focusing ultrasound transducer called Analytical Back Scattering Arrayed Ultrasound Transducer (ABSAUT). It is designed for detecting and characterizing internal defects of a sample in an analytic and quantitative way via collecting multiple back scattering ultrasound signals. Different from conventional focusing ultrasound transducers, a PVDF film with patterned electrodes is attached to the concave spherical surface for collecting back scattered ultrasounds. Standard testing including pulse-echo testing, transducer defocusing testing, tone burst source testing, and sound field scanning are carried out and all the information is recorded for performance verification. Furthermore, the angular spectrum analysis is adopted in predicting the time-domain waveforms measured by the PVDF sensing elements. In this work, we have proved that ABSAUT can collect the reflected or back scattering sound wave information from the sample under testing. And the time-domain waveforms predicted by angular spectrum algorithm also show good agreements with the data measured by PVDF sensing elements. Finally, future improvements and applications of the ABSAUT will be addressed.

原文English
主出版物標題2006 IEEE International Ultrasonics Symposium, IUS
頁面46-49
頁數4
DOIs
出版狀態Published - 2006 十二月 1
事件2006 IEEE International Ultrasonics Symposium, IUS - Vancouver, BC, Canada
持續時間: 2006 十月 32006 十月 6

出版系列

名字Proceedings - IEEE Ultrasonics Symposium
1
ISSN(列印)1051-0117

Other

Other2006 IEEE International Ultrasonics Symposium, IUS
國家Canada
城市Vancouver, BC
期間06-10-0306-10-06

指紋

Transducers
transducers
Ultrasonics
Scattering
evaluation
scattering
Testing
waveforms
defocusing
sound fields
sound waves
Acoustic fields
spectrum analysis
bursts
echoes
Spectrum analysis
Acoustic waves
scanning
electrodes
Scanning

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Acoustics and Ultrasonics

引用此文

Chung, C. H., & Lee, Y-C. (2006). A novel back scattering ultrasound transducer for non-destructive material evaluation. 於 2006 IEEE International Ultrasonics Symposium, IUS (頁 46-49). [4151881] (Proceedings - IEEE Ultrasonics Symposium; 卷 1). https://doi.org/10.1109/ULTSYM.2006.25
Chung, Cheng Hsien ; Lee, Yung-Chun. / A novel back scattering ultrasound transducer for non-destructive material evaluation. 2006 IEEE International Ultrasonics Symposium, IUS. 2006. 頁 46-49 (Proceedings - IEEE Ultrasonics Symposium).
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Chung, CH & Lee, Y-C 2006, A novel back scattering ultrasound transducer for non-destructive material evaluation. 於 2006 IEEE International Ultrasonics Symposium, IUS., 4151881, Proceedings - IEEE Ultrasonics Symposium, 卷 1, 頁 46-49, 2006 IEEE International Ultrasonics Symposium, IUS, Vancouver, BC, Canada, 06-10-03. https://doi.org/10.1109/ULTSYM.2006.25

A novel back scattering ultrasound transducer for non-destructive material evaluation. / Chung, Cheng Hsien; Lee, Yung-Chun.

2006 IEEE International Ultrasonics Symposium, IUS. 2006. p. 46-49 4151881 (Proceedings - IEEE Ultrasonics Symposium; 卷 1).

研究成果: Conference contribution

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Chung CH, Lee Y-C. A novel back scattering ultrasound transducer for non-destructive material evaluation. 於 2006 IEEE International Ultrasonics Symposium, IUS. 2006. p. 46-49. 4151881. (Proceedings - IEEE Ultrasonics Symposium). https://doi.org/10.1109/ULTSYM.2006.25