A Novel Composite Material for Electronic Packaging

Jyh-Ming Ting, M. L. Lake

研究成果: Review article同行評審

1 引文 斯高帕斯(Scopus)

摘要

A novel integral dielectric heat sink material consisting of diamond deposited carbon/carbon composite with metailic layer(s) on the diamond surface is described in this paper. The carbon/carbon composite was processed by pitch infiltration into vapour grown carbon fibre preform. Diamond coatings were then applied to the composite using a microwave enhanced chemical vapour deposition technique. Surface metallisation on the diamond coatings was performed using an electron beam evaporation technique. Characterisations including microstructure, thermal conductivity, diamond coating quality and thickness of metallised layer were carried out.

原文English
頁(從 - 到)30-31
頁數2
期刊Microelectronics International: An International Journal
12
發行號2
DOIs
出版狀態Published - 1995 二月 1

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 原子與分子物理與光學
  • 凝聚態物理學
  • 表面、塗料和薄膜
  • 電氣與電子工程

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