A Novel Composite Material for Electronic Packaging

Jyh-Ming Ting, M. L. Lake

研究成果: Review article同行評審

1 引文 斯高帕斯(Scopus)

指紋

深入研究「A Novel Composite Material for Electronic Packaging」主題。共同形成了獨特的指紋。

Engineering & Materials Science

Physics & Astronomy

Chemical Compounds