A novel method for enabling the thermosonic wire bonding of gold wire onto chips with copper interconnects

Yeau Ren Jeng, Chang Ming Wang, Sang Mao Chiu, Ching Yang Cheng

研究成果: Article同行評審

3 引文 斯高帕斯(Scopus)

摘要

The wire bonding of chips with copper interconnects is a challenging issue. The present study develops a method in which the substrates are stored in a temperature and humidity controlled environment such that copper oxide films of appropriate thickness are formed on the substrate prior to the gold-copper thermosonic bonding process. It is shown that this film can be removed during the bonding process, hence rendering the wire bonding process feasible without the requirement for an inert gas environment or the use of metallic cap layers.

原文English
文章編號3
頁(從 - 到)G335-G337
期刊Electrochemical and Solid-State Letters
7
發行號12
DOIs
出版狀態Published - 2004 十二月 1

All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)
  • Materials Science(all)
  • Physical and Theoretical Chemistry
  • Electrochemistry
  • Electrical and Electronic Engineering

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