A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients

研究成果: Conference contribution

1 引文 (Scopus)

摘要

Beam structures are widely used in MEMS sensors and actuators. MEMS micro beams are usually curled due to residual stresses and the characteristics of micro beams subjected to both residual stress gradients and electrostatic forces must be investigated for providing accuracy information for designing sensors and actuators. In this work, a novel semi-analytical formulation to address the above needs is proposed. By assuming an admissible deformation shape and utilizing energy method to determine the coefficients of the shape functions, it is possible to find the pull-in characteristics of the curled cantilevers. Detail parametric studies are subsequently performed to quantify the influence of various geometry and processing parameters on the pull-in characteristics of those micro beams. The method and results presented in this work would be very useful for related micro sensors and actuator designs.

原文English
主出版物標題ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009
頁面597-606
頁數10
DOIs
出版狀態Published - 2009 十二月 1
事件ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009 - San Diego, CA, United States
持續時間: 2009 八月 302009 九月 2

出版系列

名字Proceedings of the ASME Design Engineering Technical Conference
6

Other

OtherASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009
國家United States
城市San Diego, CA
期間09-08-3009-09-02

指紋

Residual Stress
Electrostatics
Loads (forces)
Residual stresses
Actuators
Gradient
Actuator
MEMS
Sensors
Micro-electro-mechanical Systems
Sensor
Electrostatic force
Electrostatic Force
Cantilever
Energy Method
Shape Function
Quantify
Geometry
Processing
Formulation

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Computer Graphics and Computer-Aided Design
  • Computer Science Applications
  • Modelling and Simulation

引用此文

Ou, K. S., Chen, K-S., Yang, T-S., & Lee, S-Y. (2009). A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients. 於 ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009 (頁 597-606). (Proceedings of the ASME Design Engineering Technical Conference; 卷 6). https://doi.org/10.1115/DETC2009-86977
Ou, Kuang Shun ; Chen, Kuo-Shen ; Yang, Tian-Shiang ; Lee, Sen-Yung. / A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients. ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. 2009. 頁 597-606 (Proceedings of the ASME Design Engineering Technical Conference).
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abstract = "Beam structures are widely used in MEMS sensors and actuators. MEMS micro beams are usually curled due to residual stresses and the characteristics of micro beams subjected to both residual stress gradients and electrostatic forces must be investigated for providing accuracy information for designing sensors and actuators. In this work, a novel semi-analytical formulation to address the above needs is proposed. By assuming an admissible deformation shape and utilizing energy method to determine the coefficients of the shape functions, it is possible to find the pull-in characteristics of the curled cantilevers. Detail parametric studies are subsequently performed to quantify the influence of various geometry and processing parameters on the pull-in characteristics of those micro beams. The method and results presented in this work would be very useful for related micro sensors and actuator designs.",
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Ou, KS, Chen, K-S, Yang, T-S & Lee, S-Y 2009, A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients. 於 ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. Proceedings of the ASME Design Engineering Technical Conference, 卷 6, 頁 597-606, ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009, San Diego, CA, United States, 09-08-30. https://doi.org/10.1115/DETC2009-86977

A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients. / Ou, Kuang Shun; Chen, Kuo-Shen; Yang, Tian-Shiang; Lee, Sen-Yung.

ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. 2009. p. 597-606 (Proceedings of the ASME Design Engineering Technical Conference; 卷 6).

研究成果: Conference contribution

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AB - Beam structures are widely used in MEMS sensors and actuators. MEMS micro beams are usually curled due to residual stresses and the characteristics of micro beams subjected to both residual stress gradients and electrostatic forces must be investigated for providing accuracy information for designing sensors and actuators. In this work, a novel semi-analytical formulation to address the above needs is proposed. By assuming an admissible deformation shape and utilizing energy method to determine the coefficients of the shape functions, it is possible to find the pull-in characteristics of the curled cantilevers. Detail parametric studies are subsequently performed to quantify the influence of various geometry and processing parameters on the pull-in characteristics of those micro beams. The method and results presented in this work would be very useful for related micro sensors and actuator designs.

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Ou KS, Chen K-S, Yang T-S, Lee S-Y. A novel semi-analytical approach for micro beams subjected to electrostatic loads and residual stress gradients. 於 ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference, IDETC/CIE2009. 2009. p. 597-606. (Proceedings of the ASME Design Engineering Technical Conference). https://doi.org/10.1115/DETC2009-86977