TY - GEN
T1 - A Parametric Study of Deep Perceptual Model on Visible to Thermal Face Recognition
AU - Chu, Wei Ta
AU - Wu, Jo Ning
N1 - Funding Information:
This work was partially supported by the Ministry of Science and Technology under the grant 107-2221-E-194-038-MY2 and MOST 107-2218-E-002-054, and the Advanced Institute of Manufacturing with High-tech Innovations (AIM-HI) from The Featured Areas Research Center Program within the framework of the Higher Education Sprout Project by the Ministry of Education (MOE) in Taiwan
Funding Information:
Acknowledgement. This work was partially supported by the Ministry of Science and Technology under the grant 107-2221-E-194-038-MY2 and MOST 107-2218-E-002-054, and the Advanced Institute of Manufacturing with High-tech Innovations (AIM-HI) from The Featured Areas Research Center Program within the framework of the Higher Education Sprout Project by the Ministry of Education (MOE) in Taiwan.
PY - 2018/7/2
Y1 - 2018/7/2
N2 - Recently deep perceptual mapping (DPM) based on auto-encoder provides the state-the-art thermal to visible face recognition. Features extracted from patches of a long-wave infra-red (LWIR) face image are transformed into a space by an auto-encoder, such that features from infra-red images are comparable with features from visible images. In this paper, we comprehensively evaluate DPM with different settings, in order to build a reference study for future research.
AB - Recently deep perceptual mapping (DPM) based on auto-encoder provides the state-the-art thermal to visible face recognition. Features extracted from patches of a long-wave infra-red (LWIR) face image are transformed into a space by an auto-encoder, such that features from infra-red images are comparable with features from visible images. In this paper, we comprehensively evaluate DPM with different settings, in order to build a reference study for future research.
UR - http://www.scopus.com/inward/record.url?scp=85065416163&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85065416163&partnerID=8YFLogxK
U2 - 10.1109/VCIP.2018.8698692
DO - 10.1109/VCIP.2018.8698692
M3 - Conference contribution
AN - SCOPUS:85065416163
T3 - VCIP 2018 - IEEE International Conference on Visual Communications and Image Processing
BT - VCIP 2018 - IEEE International Conference on Visual Communications and Image Processing
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 33rd IEEE International Conference on Visual Communications and Image Processing, VCIP 2018
Y2 - 9 December 2018 through 12 December 2018
ER -