A PDMS/metal-film photo-mask for large-area contact photolithograpy at sub-micrometr scale

Y. C. Lee, Y. T. Hsieh

研究成果: Conference contribution

摘要

This paper reports a new type of soft PDMS/metal-film photo-mask which can be applied in contact photolithography with a resolution at sub-micrometer scale and a patterning area over a 4 wafer. This new type of photo-mask is made from a soft PDMS mold which contains a patterned metal film on the concave surface of its microstructures. The metal film can selectively block incident UV light, while the convex PDMS microstructures can guide the incident UV light to expose a PR layer. Due to its soft and compliant property, this new soft photo-mask can from intimate contact with a substrate and carry out UV exposure to form PR microstructures. It is particularly useful in patterning slightly curved substrates such as sapphire wafers, and therefore has a great potential on manufacturing patterned sapphire substrates (PSSs) in light-emitting diodes (LEDs). In this wok, both 2 and 4 PSSs with sub-micrometer feature sizes are successfully achieved. This new type of soft photo-mask and its contact photolithography can be easily implemented at a low cost for large-area, non-flat, and sub-micrometer scaled patterning, and therefore has a great potential in many applications in the future.

原文English
主出版物標題2013 Transducers and Eurosensors XXVII
主出版物子標題The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
頁面1970-1973
頁數4
DOIs
出版狀態Published - 2013 十二月 1
事件2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013 - Barcelona, Spain
持續時間: 2013 六月 162013 六月 20

出版系列

名字2013 Transducers and Eurosensors XXVII: The 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013

Other

Other2013 17th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS and EUROSENSORS 2013
國家/地區Spain
城市Barcelona
期間13-06-1613-06-20

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 電氣與電子工程

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