A polymer stacking process with 3D electrical routings for flexible temperature sensor array and its heterogeneous integration

Wang Shen Su, Chang Hung Chen, Chih Chun Lee, Yu-Cheng Lin, Weileun Fang

研究成果: Conference contribution

2 引文 斯高帕斯(Scopus)

摘要

This study presents an unique process to integrate the temperature sensing/heating elements, multi-layer through-hole vias (THVs), and electrical routings on parylene substrate to implement a multi-functional flexible temperature sensor array. Moreover, the polymer-staking processes with 3D electrical routings enable the further integration of various devices. In application, this study also demonstrates the implementation and integration of flexible temperature sensor array by: (1) temperature distribution and contour measurement using 4×4 temperature sensor array, (2) temperature monitoring and control using the integration of Pt-sensor and Pt-heater, (3) heterogeneous integration of temperature sensor array with LED-chip for LED temperature monitoring, and (4) 3D integration of temperature sensor array with LED and micro-lens and micro chamber.

原文English
主出版物標題2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
頁面1396-1399
頁數4
DOIs
出版狀態Published - 2011 九月 1
事件2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 - Beijing, China
持續時間: 2011 六月 52011 六月 9

出版系列

名字2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

Other

Other2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
國家China
城市Beijing
期間11-06-0511-06-09

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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