TY - GEN
T1 - A polymer stacking process with 3D electrical routings for flexible temperature sensor array and its heterogeneous integration
AU - Su, Wang Shen
AU - Chen, Chang Hung
AU - Lee, Chih Chun
AU - Lin, Yu-Cheng
AU - Fang, Weileun
PY - 2011/9/1
Y1 - 2011/9/1
N2 - This study presents an unique process to integrate the temperature sensing/heating elements, multi-layer through-hole vias (THVs), and electrical routings on parylene substrate to implement a multi-functional flexible temperature sensor array. Moreover, the polymer-staking processes with 3D electrical routings enable the further integration of various devices. In application, this study also demonstrates the implementation and integration of flexible temperature sensor array by: (1) temperature distribution and contour measurement using 4×4 temperature sensor array, (2) temperature monitoring and control using the integration of Pt-sensor and Pt-heater, (3) heterogeneous integration of temperature sensor array with LED-chip for LED temperature monitoring, and (4) 3D integration of temperature sensor array with LED and micro-lens and micro chamber.
AB - This study presents an unique process to integrate the temperature sensing/heating elements, multi-layer through-hole vias (THVs), and electrical routings on parylene substrate to implement a multi-functional flexible temperature sensor array. Moreover, the polymer-staking processes with 3D electrical routings enable the further integration of various devices. In application, this study also demonstrates the implementation and integration of flexible temperature sensor array by: (1) temperature distribution and contour measurement using 4×4 temperature sensor array, (2) temperature monitoring and control using the integration of Pt-sensor and Pt-heater, (3) heterogeneous integration of temperature sensor array with LED-chip for LED temperature monitoring, and (4) 3D integration of temperature sensor array with LED and micro-lens and micro chamber.
UR - http://www.scopus.com/inward/record.url?scp=80052136103&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=80052136103&partnerID=8YFLogxK
U2 - 10.1109/TRANSDUCERS.2011.5969532
DO - 10.1109/TRANSDUCERS.2011.5969532
M3 - Conference contribution
AN - SCOPUS:80052136103
SN - 9781457701573
T3 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
SP - 1396
EP - 1399
BT - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
T2 - 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
Y2 - 5 June 2011 through 9 June 2011
ER -