A stacked memory device on logic 3D technology for ultra-high-density data storage

Jiyoung Kim, Augustin J. Hong, Sung Min Kim, Kyeong Sik Shin, Emil B. Song, Yongha Hwang, Faxian Xiu, Kosmas Galatsis, Chi On Chui, Rob N. Candler, Siyoung Choi, Joo Tae Moon, Kang L. Wang

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37 引文 斯高帕斯(Scopus)

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Engineering & Materials Science