A study of friction and adhesion properties of ODS film on MEMS device

Jeng Haur Horng, Jen Fin Lin, Shin Yuh Chern, Chin Chung Wei, Chun Yueh Chen

研究成果: Conference contribution

摘要

With the rapid development of microelectromechanical systems (MEMS) technology, materials such as silicon, metal, and polymers are widely used in the MEMS field. One of the reliability concerns related to Si MEMS is unwanted wear and adhesion. Therefore, SiC film is a possible choice for surfaces because of its favorable friction and wear properties such as used in cutting tool and transmission system of wind turbine. In this study, biocompatible SAM film (ODS) was used to decrease the adhesion force and the friction coefficient of SiC surface. Experimental results show that ODS can increase the contact angle and decrease the surface roughness value of SiC surfaces for the different roughness values and roughness directions. For Si, SiC film and SAMs film on surfaces, larger normal forces lead to smaller friction coefficients and cross roughness pattern have a smaller friction coefficient than that of straight roughness pattern. In addition, ODS film can decrease the friction coefficient on cross topography with relative small roughness value more effectively than can straight topography of SiC surfaces.

原文English
主出版物標題Advances in Manufacturing Technology
頁面915-920
頁數6
DOIs
出版狀態Published - 2012
事件2nd International Conference on Advanced Design and Manufacturing Engineering, ADME 2012 - Taiyuan, China
持續時間: 2012 八月 162012 八月 18

出版系列

名字Applied Mechanics and Materials
220-223
ISSN(列印)1660-9336
ISSN(電子)1662-7482

Other

Other2nd International Conference on Advanced Design and Manufacturing Engineering, ADME 2012
國家/地區China
城市Taiyuan
期間12-08-1612-08-18

All Science Journal Classification (ASJC) codes

  • 工程 (全部)

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