A study of green Sn-xZn photovoltaic ribbons for solar cell application

Kuan Jen Chen, Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Yu Wen Chen

研究成果: Article同行評審

9 引文 斯高帕斯(Scopus)

摘要

Sn-xZn (x=9, 25, and 50 wt%) alloy solders were applied in a photovoltaic (PV) ribbon. The effects of intermetallic compounds (IMCs) on series resistance and bond reliability of Sn-xZn PV modules were investigated. Cu5Zn8 and AgZn3 IMCs were found at the interfaces (solder/Cu and solder/Ag). The Zn content in the solder dominated the growth behavior of IMCs at the interface. The IMC thickness increased with increasing Zn content in the solder, and thus the bond reliability of the PV module deteriorated. After a bias was applied for a long duration, the interfacial characteristics and solder matrix were affected by the bias-induced thermal diffusion. In addition, the evolution in IMCs due to thermal diffusion during bias changed the original series resistance of the ribbon material and affected the series resistance of the PV module.

原文English
頁(從 - 到)561-566
頁數6
期刊Solar Energy Materials and Solar Cells
143
DOIs
出版狀態Published - 2015

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 可再生能源、永續發展與環境
  • 表面、塗料和薄膜

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