A study of mini-channel thermal module design for achieving high stability and high capability in electronic cooling

Hsiang Li Wang, Huang Ching Wu, S. Kong Wang, Tzu Chen Hung, Ruey Jen Yang

研究成果: Article

17 引文 斯高帕斯(Scopus)

摘要

In this study, pressure drop and heat transfer characteristics of multiple-mini-channel thermal modules were investigated quantitatively. The flow channels, which were mounted on one side of a copper test section, were designed in three types: (1) the first module consists of fourteen straight and parallel channels with a rectangular cross section of 1 mm × 3 mm, (2) the second module consists of fourteen gradually widening channels with a U-shaped cross section starting from an inlet section of 0.5 mm × 3 mm and increasing to an outlet section of 1 mm × 3 mm, and (3) the third module is similar to the second module except for the rectangular cross section. Visual observations and the measured boiling curves show that, in the straight channels, some bubbles cannot be flushed out of the channels fast enough, so they tend to flow back and accumulate at the entrance. This results in a rather dry channel condition for CHF (critical heat flux) to occur for the cases with low flow rates. For the widening channel modules, no occurrence of CHF was observed under an even lower operating pressure in an attempt to induce the incipient of CHF. Under a similar temperature rise at the channel exit, the maximum heat removal rate of the widening channels reaches 27 W/cm2 which is at least twice as high as that of the straight channels.

原文English
頁(從 - 到)1144-1153
頁數10
期刊Applied Thermal Engineering
51
發行號1-2
DOIs
出版狀態Published - 2013 一月 1

All Science Journal Classification (ASJC) codes

  • Energy Engineering and Power Technology
  • Industrial and Manufacturing Engineering

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