@inproceedings{d5a999973c9047caabf24b4851aa71af,
title = "A Study of Underfill Dispensing Patterns in Flip-Chip Packaging",
abstract = "In view of the continuous growth of digital-twin in the technology and industry in recent years, this study conducted the digital mapping of the underfill dispensing process through experiment and simulation to understand and solve the void problem that frequently occurred in flip-chip packaging.",
author = "Chen, {Dao Long} and Chang, {Hui Jing} and Chen, {Tang Yuan} and Hu, {Yung Hsiang} and Chen, {Ting Bin} and Pan, {Chi Hung} and Yang, {Yu Shuo} and Hwang, {Sheng Jye}",
note = "Publisher Copyright: {\textcopyright} 2023 Japan Institute of Electronics Packaging.; 22nd International Conference on Electronics Packaging, ICEP 2023 ; Conference date: 19-04-2023 Through 22-04-2023",
year = "2023",
doi = "10.23919/ICEP58572.2023.10129757",
language = "English",
series = "2023 International Conference on Electronics Packaging, ICEP 2023",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "115--116",
booktitle = "2023 International Conference on Electronics Packaging, ICEP 2023",
address = "United States",
}