A Study of Underfill Dispensing Patterns in Flip-Chip Packaging

Dao Long Chen, Hui Jing Chang, Tang Yuan Chen, Yung Hsiang Hu, Ting Bin Chen, Chi Hung Pan, Yu Shuo Yang, Sheng Jye Hwang

研究成果: Conference contribution

2 引文 斯高帕斯（Scopus）

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Engineering & Materials Science

Chemical Compounds