A study on annealing mechanisms with different manganese contents in CuMn alloy

Chia Yang Wu, Chi Ting Wu, Wen Hsi Lee, Shih Chieh Chang, Ying Lang Wang

研究成果: Article同行評審

15 引文 斯高帕斯(Scopus)

摘要

In this paper, the effect of Mn in the CuMn alloy was investigated. And an optimized concentration of Mn in CuMn alloy used as barrier layers was also determined. The electrical and material properties of Copper (Cu) (0.1-10 at.% Mn) alloy and pure Cu films deposited on silicon oxide (SiO 2)/silicon (Si) are researched. A diffusion barrier layer was self-formed at the interface during annealing, and the growth behavior followed a logarithmic rate law. The microstructures of the Cu-Mn films were analyzed by transmission electron microscopy (TEM), and then correlated with the electrical properties of the Cu-Mn films. After annealing, several Cu alloys and pure Cu films appeared to aggregate and the resistance of the films increased. The Cu atoms diffused into the dielectric layers after annealing at 500 °C under vacuum condition. However, no agglomeration and Cu were found in the SiO 2 layer using Cu-Mn alloy with an appropriate amount of Mn, suggesting that a MnSi xO y layer is a suitable barrier for Cu. In the experiment, we found that Mn concentration is one of the key factors in the semiconductor process, and the Cu-5 at.% Mn film demonstrates the best barrier properties.

原文English
頁(從 - 到)118-123
頁數6
期刊Journal of Alloys and Compounds
542
DOIs
出版狀態Published - 2012 十一月 25

All Science Journal Classification (ASJC) codes

  • 材料力學
  • 機械工業
  • 金屬和合金
  • 材料化學

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