A study on electromigration-inducing intergranular fracture of fine silver alloy wires

Hao Wen Hsueh, Fei Yi Hung, Truan Sheng Lui

研究成果: Article同行評審

5 引文 斯高帕斯(Scopus)

摘要

In this study, Pd-coated Cu, Ag (purity = 4 N), and Ag alloy (Ag-8Au-3Pd) wires were employed to measure the tensile properties during current stressing using the so-called dynamic current tensile (DCT) test. Both the tensile strength and elongation of the wires decreased dramatically in the DCT test, particularly of the Ag-based wires, and the fracture morphology of the Cu-based and Ag-based wires was ductile fracture and intergranular fracture, respectively. Compared to the Cu-based wires, electromigration occurred more easily in the Ag-based wires, and it always generated voids and cracks at the grain boundaries; therefore, the fracture morphology of the Ag-based wires was intergranular fracture owing to the weakened grain boundary. Further, the results indicated that the Ag-based wires could not carry a higher current density than the Cu-based wires, primarily because their extremely low strength and elongation in current stressing might cause serious reliability problems.

原文English
文章編號031902
期刊Applied Physics Letters
110
發行號3
DOIs
出版狀態Published - 2017 一月 16

All Science Journal Classification (ASJC) codes

  • Physics and Astronomy (miscellaneous)

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