A study on sputtering of copper seed layer for interconnect metallization via molecular dynamics simulation

Cheng Hsuan Ho, Cha’O Kuang Chen, Chieh Li Chen

研究成果: Article同行評審

指紋

深入研究「A study on sputtering of copper seed layer for interconnect metallization via molecular dynamics simulation」主題。共同形成了獨特的指紋。

Engineering & Materials Science

Physics & Astronomy

Chemical Compounds