A Technology for Bonding Cu Wires with Cu Pads: Structure and Electrical Fatigue Mechanism of Fine Micro-alloyed Cu Wires

Engineering & Materials Science

• Copper 100%
• Fatigue of materials 84%
• Gold 44%
• Grain refinement 16%
• Industry 5%
• Intermetallics 14%
• Mechanical properties 8%
• Packaging 12%
• Palladium 53%
• Platinum 63%
• Substrates 48%
• Wire 91%

Chemical Compounds

• Amount 17%
• Grain Refinement 57%
• Industry 30%
• Intermetallic Compound 43%
• Palladium 93%
• Platinum 90%
• Purity 20%
• Resistance 25%
• Surface 13%

Physics & Astronomy

• copper 87%
• fatigue life 18%
• gold 31%
• industries 11%
• intermetallics 12%
• mechanical properties 9%
• packaging 14%
• palladium 43%
• platinum 53%
• wire 91%