摘要
This paper presents a comprehensive theoretical modeling for the laser assisted direct imprinting (LADI) process, which utilizes a quartz mold, pulsed laser heating, and contact pressure for direct nano-patterning and nanostructure fabrication on silicon substartes. The purpose of this work is to reveal the underlying mechanism behind LADI and to quantitatively characterize important imprinting parameters which dominate a successful LADI process. The theoretical modeling consists of three elements, the time-history of silicon melting when subjected to pulsed laser heating, the elastodynamic movement of mold's surface under resistance pressure, and the squeezing out of the molten silicon layer under the pressure from the walls. We have accurately determined the governing equations for each physical problems and derive the interaction relationship between them. A numerical scheme is developed to modeling the whole LADI process. The role of each important factor such as laser fiuence, contact pressure, viscosity of molten substance, and mold's feature size can be understood and visualized through this model and their influences on the final imprinting depth are also quantitatively determined.
| 原文 | English |
|---|---|
| 主出版物標題 | Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 |
| 頁面 | 493-496 |
| 頁數 | 4 |
| DOIs | |
| 出版狀態 | Published - 2007 八月 28 |
| 事件 | 2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 - Bangkok, Thailand 持續時間: 2007 一月 16 → 2007 一月 19 |
出版系列
| 名字 | Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 |
|---|
Other
| Other | 2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 |
|---|---|
| 國家 | Thailand |
| 城市 | Bangkok |
| 期間 | 07-01-16 → 07-01-19 |
指紋
All Science Journal Classification (ASJC) codes
- Computer Networks and Communications
- Computer Science Applications
- Electrical and Electronic Engineering
引用此文
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A theoretical model for Laser Assisted Direct Imprinting (LADI). / Lee, Yung-Chun; Chung, Ming Hung; Ruan, Jun Yi; Hsiao, Fei Bin.
Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007. 2007. p. 493-496 4160368 (Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007).研究成果: Conference contribution
TY - GEN
T1 - A theoretical model for Laser Assisted Direct Imprinting (LADI)
AU - Lee, Yung-Chun
AU - Chung, Ming Hung
AU - Ruan, Jun Yi
AU - Hsiao, Fei Bin
PY - 2007/8/28
Y1 - 2007/8/28
N2 - This paper presents a comprehensive theoretical modeling for the laser assisted direct imprinting (LADI) process, which utilizes a quartz mold, pulsed laser heating, and contact pressure for direct nano-patterning and nanostructure fabrication on silicon substartes. The purpose of this work is to reveal the underlying mechanism behind LADI and to quantitatively characterize important imprinting parameters which dominate a successful LADI process. The theoretical modeling consists of three elements, the time-history of silicon melting when subjected to pulsed laser heating, the elastodynamic movement of mold's surface under resistance pressure, and the squeezing out of the molten silicon layer under the pressure from the walls. We have accurately determined the governing equations for each physical problems and derive the interaction relationship between them. A numerical scheme is developed to modeling the whole LADI process. The role of each important factor such as laser fiuence, contact pressure, viscosity of molten substance, and mold's feature size can be understood and visualized through this model and their influences on the final imprinting depth are also quantitatively determined.
AB - This paper presents a comprehensive theoretical modeling for the laser assisted direct imprinting (LADI) process, which utilizes a quartz mold, pulsed laser heating, and contact pressure for direct nano-patterning and nanostructure fabrication on silicon substartes. The purpose of this work is to reveal the underlying mechanism behind LADI and to quantitatively characterize important imprinting parameters which dominate a successful LADI process. The theoretical modeling consists of three elements, the time-history of silicon melting when subjected to pulsed laser heating, the elastodynamic movement of mold's surface under resistance pressure, and the squeezing out of the molten silicon layer under the pressure from the walls. We have accurately determined the governing equations for each physical problems and derive the interaction relationship between them. A numerical scheme is developed to modeling the whole LADI process. The role of each important factor such as laser fiuence, contact pressure, viscosity of molten substance, and mold's feature size can be understood and visualized through this model and their influences on the final imprinting depth are also quantitatively determined.
UR - http://www.scopus.com/inward/record.url?scp=34548120204&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=34548120204&partnerID=8YFLogxK
U2 - 10.1109/NEMS.2007.352065
DO - 10.1109/NEMS.2007.352065
M3 - Conference contribution
AN - SCOPUS:34548120204
SN - 1424406102
SN - 9781424406104
T3 - Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
SP - 493
EP - 496
BT - Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
ER -