A theoretical model for Laser Assisted Direct Imprinting (LADI)

Yung-Chun Lee, Ming Hung Chung, Jun Yi Ruan, Fei Bin Hsiao

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

This paper presents a comprehensive theoretical modeling for the laser assisted direct imprinting (LADI) process, which utilizes a quartz mold, pulsed laser heating, and contact pressure for direct nano-patterning and nanostructure fabrication on silicon substartes. The purpose of this work is to reveal the underlying mechanism behind LADI and to quantitatively characterize important imprinting parameters which dominate a successful LADI process. The theoretical modeling consists of three elements, the time-history of silicon melting when subjected to pulsed laser heating, the elastodynamic movement of mold's surface under resistance pressure, and the squeezing out of the molten silicon layer under the pressure from the walls. We have accurately determined the governing equations for each physical problems and derive the interaction relationship between them. A numerical scheme is developed to modeling the whole LADI process. The role of each important factor such as laser fiuence, contact pressure, viscosity of molten substance, and mold's feature size can be understood and visualized through this model and their influences on the final imprinting depth are also quantitatively determined.

原文English
主出版物標題Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
頁面493-496
頁數4
DOIs
出版狀態Published - 2007 八月 28
事件2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007 - Bangkok, Thailand
持續時間: 2007 一月 162007 一月 19

出版系列

名字Proceedings of the 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007

Other

Other2007 2nd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, IEEE NEMS 2007
國家/地區Thailand
城市Bangkok
期間07-01-1607-01-19

All Science Journal Classification (ASJC) codes

  • 電腦網路與通信
  • 電腦科學應用
  • 電氣與電子工程

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