A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions

Hung Chun Yang, Tz Cheng Chiu

研究成果: Article同行評審

2 引文 斯高帕斯(Scopus)

摘要

A viscoplastic model based on the Chaboche framework was developed to consider the behaviors of Sn3.0Ag0.5Cu solder under tensile, creep, relaxation and cyclic conditions at a wide range of temperatures. The experimentally-observed strong softening responses, especially at lower strain rates and higher temperatures, were modeled by incorporating evolutionary dynamic recovery parameters, which depend both on the accumulated viscoplastic strain and the strain memory surface. Temperature rate terms were also included to consider the thermomechanical response. The viscoplastic model parameters were obtained by using a two-step procedure and validated to experimental data by using Runge-Kutta and finite element simulations.

原文English
文章編號114086
期刊Microelectronics Reliability
119
DOIs
出版狀態Published - 2021 四月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 原子與分子物理與光學
  • 凝聚態物理學
  • 安全、風險、可靠性和品質
  • 表面、塗料和薄膜
  • 電氣與電子工程

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