A viscoplastic-based fatigue reliability model for the polyimide dielectric thin film

Yu Chen Chang, Tz Cheng Chiu, Yu Ting Yang, Yi Hsiu Tseng, Xi Hong Chen

研究成果: Conference contribution

摘要

In this study the fatigue characteristics of polyimide thin film used in redistribution interconnects were considered. Cyclic tension tests under various stress-and strain-ranges were performed to investigate the damage accumulation in the thin film. It was observed that, under cyclic strain loading, the deformation of the thin film is mainly governed by viscoelastic stress relaxation behavior, and damage of the thin film is insignificant. On the other hand, the thin film under cyclic stress loading exhibits a viscoplastic ratcheting response. Furthermore, the envelope of the strain response under stress-controlled cycling increases as the fatigue cycle increases. A phenomenological model was developed for characterizing the damage accumulation under cyclic stress condition. The model considers the viscoplastic response by superpositioning a power-law plastic model and a linear viscoelastic model for predicting the growth of the strain envelope. The fatigue prediction model can be applied for predicting the fatigue failure of the polyimide dielectric in the redistribution interconnects.

原文English
主出版物標題Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
發行者Institute of Electrical and Electronics Engineers Inc.
頁面1359-1365
頁數7
ISBN(電子)9781728114989
DOIs
出版狀態Published - 2019 五月
事件69th IEEE Electronic Components and Technology Conference, ECTC 2019 - Las Vegas, United States
持續時間: 2019 五月 282019 五月 31

出版系列

名字Proceedings - Electronic Components and Technology Conference
2019-May
ISSN(列印)0569-5503

Conference

Conference69th IEEE Electronic Components and Technology Conference, ECTC 2019
國家United States
城市Las Vegas
期間19-05-2819-05-31

    指紋

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

引用此

Chang, Y. C., Chiu, T. C., Yang, Y. T., Tseng, Y. H., & Chen, X. H. (2019). A viscoplastic-based fatigue reliability model for the polyimide dielectric thin film. 於 Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019 (頁 1359-1365). [8811235] (Proceedings - Electronic Components and Technology Conference; 卷 2019-May). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ECTC.2019.00210