TY - GEN
T1 - A viscoplastic-based fatigue reliability model for the polyimide dielectric thin film
AU - Chang, Yu Chen
AU - Chiu, Tz Cheng
AU - Yang, Yu Ting
AU - Tseng, Yi Hsiu
AU - Chen, Xi Hong
N1 - Funding Information:
ACKNOWLEDGMENT This study was partially supported by the Ministry of Science and Technology, ROC, under the grants MOST 104-2221-E-006-056-MY2, MOST 107-2221-E-006-138 and by ASE Group.
Funding Information:
This study was partially supported by the Ministry of Science and Technology, ROC, under the grants MOST 104- 2221-E-006-056-MY2, MOST 107-2221-E-006-138 and by ASE Group.
Publisher Copyright:
© 2019 IEEE.
PY - 2019/5
Y1 - 2019/5
N2 - In this study the fatigue characteristics of polyimide thin film used in redistribution interconnects were considered. Cyclic tension tests under various stress-and strain-ranges were performed to investigate the damage accumulation in the thin film. It was observed that, under cyclic strain loading, the deformation of the thin film is mainly governed by viscoelastic stress relaxation behavior, and damage of the thin film is insignificant. On the other hand, the thin film under cyclic stress loading exhibits a viscoplastic ratcheting response. Furthermore, the envelope of the strain response under stress-controlled cycling increases as the fatigue cycle increases. A phenomenological model was developed for characterizing the damage accumulation under cyclic stress condition. The model considers the viscoplastic response by superpositioning a power-law plastic model and a linear viscoelastic model for predicting the growth of the strain envelope. The fatigue prediction model can be applied for predicting the fatigue failure of the polyimide dielectric in the redistribution interconnects.
AB - In this study the fatigue characteristics of polyimide thin film used in redistribution interconnects were considered. Cyclic tension tests under various stress-and strain-ranges were performed to investigate the damage accumulation in the thin film. It was observed that, under cyclic strain loading, the deformation of the thin film is mainly governed by viscoelastic stress relaxation behavior, and damage of the thin film is insignificant. On the other hand, the thin film under cyclic stress loading exhibits a viscoplastic ratcheting response. Furthermore, the envelope of the strain response under stress-controlled cycling increases as the fatigue cycle increases. A phenomenological model was developed for characterizing the damage accumulation under cyclic stress condition. The model considers the viscoplastic response by superpositioning a power-law plastic model and a linear viscoelastic model for predicting the growth of the strain envelope. The fatigue prediction model can be applied for predicting the fatigue failure of the polyimide dielectric in the redistribution interconnects.
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U2 - 10.1109/ECTC.2019.00210
DO - 10.1109/ECTC.2019.00210
M3 - Conference contribution
AN - SCOPUS:85072277348
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1359
EP - 1365
BT - Proceedings - IEEE 69th Electronic Components and Technology Conference, ECTC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 69th IEEE Electronic Components and Technology Conference, ECTC 2019
Y2 - 28 May 2019 through 31 May 2019
ER -