Ablation of silicon by focusing a femtosecond laser through a subwavelength annular aperture structure

Y. Y. Yu, C. K. Chang, M. W. Lai, L. S. Huang, C. K. Lee

研究成果: Conference contribution

1 引文 斯高帕斯(Scopus)

摘要

We experimentally examined the effect of laser energy fluence on the ablation of a silicon wafer using a Ti:sapphire femtosecond laser system. A femtosecond laser was focused through an oxide-metal-oxide (Al2O 3/Al/Al2O3) film engraved with a subwavelength annular aperture (SAA) structure, i.e., a Bessel beam composed of a femtosecond laser created using a SAA. The optical performance, such as depth-of-focus (DOF) and focal spot of the SAA structure, was simulated using finite-difference time domain (FDTD) calculations. We found that a far-field laser beam propagating through the SAA structure possesses a sub-micron focal spot as well as high focus intensity. The experimental results demonstrated that silicon can be ablated using an input ablation threshold of an order of 0.05 J/cm2 with a pulse duration at around 120fs. We found the obtained surface hole to have a diameter smaller than 1μm. Different surface ablation results obtained by using different threshold fluences of input laser energy are shown. Possible applications of this technique includes executing high aspect ratio laser drilling for thin film microfabrication undertaking thru silicon via (TSV) for 3DIC, etc.

原文English
主出版物標題Laser Beam Shaping XI
DOIs
出版狀態Published - 2010 十月 28
事件Laser Beam Shaping XI - San Diego, CA, United States
持續時間: 2010 八月 22010 八月 2

出版系列

名字Proceedings of SPIE - The International Society for Optical Engineering
7789
ISSN(列印)0277-786X

Conference

ConferenceLaser Beam Shaping XI
國家United States
城市San Diego, CA
期間10-08-0210-08-02

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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