Abrasion and dissolution interaction of Al in a phosphoric acid solution

Wen Ta Tsai, Tsung Min Huang

研究成果: Article同行評審

7 引文 斯高帕斯(Scopus)


By employing a rotating cylinder system, the roles of mechanical abrasion and electrochemical dissolution during Al CMP were studied. Under rotating and abrasive conditions, both the total metal removal rate and the electrochemical dissolution rate of Al in 5 vol.% phosphoric acid+0.5 M citric acid solution (pH 4) increased with an increase in both contact pressure and specimen rotation speed. However, the contribution of electrochemical dissolution to the total removal rate of Al was less than that of mechanical abrasion with a contact force in the range of 0.98-4.90 N. After the abrasive test, metallic Al was present in the solution, indicating that passive film was not the sole material removed under the chemical-mechanical abrasion condition.

頁(從 - 到)107-113
期刊Thin Solid Films
出版狀態Published - 2000 12月 8

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 表面和介面
  • 表面、塗料和薄膜
  • 金屬和合金
  • 材料化學


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