Abrasion and dissolution interaction of Al in a phosphoric acid solution

Wen Ta Tsai, Tsung Min Huang

研究成果: Article同行評審

7 引文 斯高帕斯(Scopus)

摘要

By employing a rotating cylinder system, the roles of mechanical abrasion and electrochemical dissolution during Al CMP were studied. Under rotating and abrasive conditions, both the total metal removal rate and the electrochemical dissolution rate of Al in 5 vol.% phosphoric acid+0.5 M citric acid solution (pH 4) increased with an increase in both contact pressure and specimen rotation speed. However, the contribution of electrochemical dissolution to the total removal rate of Al was less than that of mechanical abrasion with a contact force in the range of 0.98-4.90 N. After the abrasive test, metallic Al was present in the solution, indicating that passive film was not the sole material removed under the chemical-mechanical abrasion condition.

原文English
頁(從 - 到)107-113
頁數7
期刊Thin Solid Films
379
發行號1-2
DOIs
出版狀態Published - 2000 十二月 8

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

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