Abrasive distribution of the fixed diamond wire in wire sawing process

研究成果: Conference contribution

4 引文 斯高帕斯(Scopus)

摘要

Fixed diamond wire saw has the advantages such as higher cutting rate and clearer operating environment over the slurry wire saw in wafering. However, the higher cost and poor sliced wafer surface are still the obstacles for the diamond wire saw to totally replace slurry wire saw. In this study, the distribution of diamond grits on the wire was investigated by numerical simulation. The results show that there is a critical value of the abrasive interval to transfer the machining mechanism from plastic plowing to brittle indentation cracking for the material removal. The value depends on both the wire tension and bow angle during the operation.

原文English
主出版物標題Advanced Manufacturing Focusing on Multi-Disciplinary Technologies
頁面145-152
頁數8
DOIs
出版狀態Published - 2012
事件4th International Conference on Advanced Manufacturing, ICAM 2012 - Jiaoxi, Taiwan
持續時間: 2012 三月 42012 三月 8

出版系列

名字Advanced Materials Research
579
ISSN(列印)1022-6680

Other

Other4th International Conference on Advanced Manufacturing, ICAM 2012
國家Taiwan
城市Jiaoxi
期間12-03-0412-03-08

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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