Accelerated recrystallization in electrodeposited dual-layer copper thin films

N. Alshwawreh, M. Militzer, D. Bizzotto, Jui-Chao Kuo

研究成果: Article同行評審

1 引文 斯高帕斯(Scopus)

摘要

Recrystallization was studied in 1 μm-thick Cu films electrodeposited using a two-stage strategy. In each stage, the film was deposited at either low or high current density. The effect of varying the thickness of the layer deposited at high current density on the recrystallization rate was investigated. The recrystallization kinetics were determined using resistivity and electron back-scatter diffraction (EBSD) techniques. Recrystallization rate increases with the thickness of the layer deposited at high current density independent of the order of deposition.

原文English
期刊Journal of the Electrochemical Society
160
發行號12
DOIs
出版狀態Published - 2013

All Science Journal Classification (ASJC) codes

  • Electrochemistry
  • Electronic, Optical and Magnetic Materials
  • Materials Chemistry
  • Surfaces, Coatings and Films
  • Renewable Energy, Sustainability and the Environment
  • Condensed Matter Physics

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