Accuracy and real-time considerations for implementing various virtual metrology algorithms

Yu Chuan Su, Tung Ho Lin, Fan Tien Cheng, Wei Ming Wu

研究成果: Article同行評審

44 引文 斯高帕斯(Scopus)

摘要

In the semiconductor industry, run-to-run (R2R) control is an important technique to improve process capability and further enhance the production yield. As the dimension of electronic devices shrink increasingly, wafer-to-wafer (W2W) advanced process control (APC) becomes essential for the critical stages of production processes. W2W APC requires the metrology values of each wafer; however, it will be highly time and cost consuming to obtain actual metrology values from each wafer by physical measurement. Recently, an efficient and cost-effective approach denoted "virtual metrology (VM)" was proposed to substitute the actual metrology. To implement VM in W2W APC, both conjecture-accuracy and real-time requirements need to be considered. In this paper, various VM algorithms, including back-propagation neural networks (BPNN), simple recurrent neural networks (SRNN), and multiple regression (MR), are evaluated to see whether they can meet the accuracy and real-time requirements of W2W APC or not. The fifth generation TFT-LCD chemical-vapor deposition process is used to test and verify the requirements. Test results show that both one-hidden-layered BPNN and SRNN VM algorithms achieve acceptable conjecture accuracy and meet the real-time requirements of semiconductor and TFT-LCD W2W APC applications.

原文English
文章編號4589025
頁(從 - 到)426-434
頁數9
期刊IEEE Transactions on Semiconductor Manufacturing
21
發行號3
DOIs
出版狀態Published - 2008 八月

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 凝聚態物理學
  • 工業與製造工程
  • 電氣與電子工程

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