Adhesion strengths of Al/Mo/Ni and Al/Zn/Ni-P multilayers on silicon were investigated with a pull test. Attempts were made to investigate the adhesion strengths of the structures on silicon for the Al unilayer, Al/Mo and Al/Zn bilayers, and Al/Mo/Ni and Al/Zn/Ni-P trilayers. Analysis of the fracture surface clearly revealed the effect of additional layers on the adhesion strengths of the Al deposit. The sputter-deposited Ni layer and the electrolessly deposited Ni-P layer tend to suppress the adhesion strength of the Al/Si. The zincating deposition may compensate for the negative effect of the Ni-P deposit on the adhesion strength of Al/Sl.
|頁（從 - 到）||253-257|
|期刊||Journal of Materials Science: Materials in Electronics|
|出版狀態||Published - 1997|
All Science Journal Classification (ASJC) codes