Adhesion of multilayer solder pads on silicon

研究成果: Article同行評審

7 引文 斯高帕斯(Scopus)

摘要

Adhesion strengths of Al/Mo/Ni and Al/Zn/Ni-P multilayers on silicon were investigated with a pull test. Attempts were made to investigate the adhesion strengths of the structures on silicon for the Al unilayer, Al/Mo and Al/Zn bilayers, and Al/Mo/Ni and Al/Zn/Ni-P trilayers. Analysis of the fracture surface clearly revealed the effect of additional layers on the adhesion strengths of the Al deposit. The sputter-deposited Ni layer and the electrolessly deposited Ni-P layer tend to suppress the adhesion strength of the Al/Si. The zincating deposition may compensate for the negative effect of the Ni-P deposit on the adhesion strength of Al/Sl.

原文English
頁(從 - 到)253-257
頁數5
期刊Journal of Materials Science: Materials in Electronics
8
發行號4
DOIs
出版狀態Published - 1997

All Science Journal Classification (ASJC) codes

  • 電子、光磁材料
  • 原子與分子物理與光學
  • 凝聚態物理學
  • 電氣與電子工程

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