Multilayer Fe–Si–Cr alloy chip power inductors have the benefits of a smaller, thinner profile, lower DC resistance and higher rated current. During metal multilayer power inductor co-firing, Fe–Si–Cr alloy powders react with the inner electrode, silver, to form a large amount of hexagonal flaky AgCrO 2 . The p-type semiconductor, AgCrO 2 , will cause co-fired Fe–Si–Cr alloy multilayer chip power inductor insulation degradation, hence reducing the power conversion efficiency due to the increase in eddy current loss. The AgCrO 2 forming mechanism is investigated in this study. It was observed that silver reacts with the Fe–Si–Cr thermal grown oxide layer, Cr 2 O 3 , and subsequently leads to the formation of Ag 2 CrO 4 when the temperature is lower than 650 °C. The formed Ag 2 CrO 4 with low melting temperature then volatilizes at higher temperatures through the pore channels to react with the volatilized Cr 2 O 3 to form the AgCrO 2 . AgCrO 2 will cause Fe–Si–Cr alloy multilayer chip inductor resistivity and breakdown voltage degradation.
|期刊||Journal of Materials Science: Materials in Electronics|
|出版狀態||Published - 2019 一月 1|
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