Alternative layouts for air distribution improvement of a computing data center

F. J. Wang, C. M. Lai, Y. S. Huang, J. S. Huang

研究成果: Conference contribution

3 引文 斯高帕斯(Scopus)

摘要

In this study, numerical simulation by using computational fluid dynamics (CFD) codes were conducted to investigate the influence of alternative layouts for air distribution in a full scale newly constructed data center. Through the simulation of different airflow distribution patterns in the data center, the optimum practice for cooling airflow arrangement can be identified easily. The simulation results also revealed that the best practice with a vertical under floor cooling architecture can provide satisfactory airflow distribution and thermal management. Higher cooling performance can be achieved by providing better separation of cold and hot aisle stream. Rack cooling index (RCI) has been used to evaluate the cooling performance of environmental conditions for the data center facility. Numerical study through CFD simulation can not only identify the best practice for airflow distribution, but also provide the energy-efficient and cost-effective HVAC system specific for data center facility.

原文English
主出版物標題Micro Nano Devices, Structure and Computing Systems II
發行者Trans Tech Publications Ltd
頁面282-285
頁數4
ISBN(列印)9783037856420
DOIs
出版狀態Published - 2013
事件2013 2nd International Conference on Micro Nano Devices, Structure and Computing Systems, MNDSCS 2013 - Shenzhen, China
持續時間: 2013 1月 232013 1月 24

出版系列

名字Advanced Materials Research
677
ISSN(列印)1022-6680

Other

Other2013 2nd International Conference on Micro Nano Devices, Structure and Computing Systems, MNDSCS 2013
國家/地區China
城市Shenzhen
期間13-01-2313-01-24

All Science Journal Classification (ASJC) codes

  • 一般工程

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