TY - GEN
T1 - An Aging Detection and Tolerance Framework for 8T SRAM Dot Product CIM Engine
AU - Chen, Yu Guang
AU - Wang, Chi Hsu
AU - Lin, Ing Chao
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - Computing In-Memory (CIM), which directly performs in-situ operations at memory, is one of the promising solutions to overcome von Neumann bottleneck. Previous researchers have proposed an 8T-SRAM-based CIM structure to perform dot product (DP) computations by analog charging/discharging operations. However, CIM structure may suffer from variations and aging effects such as BTI and HCI, which threat the reliability of CIM operation results. In this paper, we propose an agingaware CIM operation framework which consists of an aging detection method and an aging tolerance technique. Specifically, we apply Dynamic Voltage Scaling (DVS) on affected CIM structure to compensate the current drop due to variations and aging effects. Experimental results show that our method can successfully calibrate dropped current and thus maintain the reliability of CIM operations.
AB - Computing In-Memory (CIM), which directly performs in-situ operations at memory, is one of the promising solutions to overcome von Neumann bottleneck. Previous researchers have proposed an 8T-SRAM-based CIM structure to perform dot product (DP) computations by analog charging/discharging operations. However, CIM structure may suffer from variations and aging effects such as BTI and HCI, which threat the reliability of CIM operation results. In this paper, we propose an agingaware CIM operation framework which consists of an aging detection method and an aging tolerance technique. Specifically, we apply Dynamic Voltage Scaling (DVS) on affected CIM structure to compensate the current drop due to variations and aging effects. Experimental results show that our method can successfully calibrate dropped current and thus maintain the reliability of CIM operations.
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U2 - 10.1109/ISOCC56007.2022.10031538
DO - 10.1109/ISOCC56007.2022.10031538
M3 - Conference contribution
AN - SCOPUS:85148450193
T3 - Proceedings - International SoC Design Conference 2022, ISOCC 2022
SP - 161
EP - 162
BT - Proceedings - International SoC Design Conference 2022, ISOCC 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 19th International System-on-Chip Design Conference, ISOCC 2022
Y2 - 19 October 2022 through 22 October 2022
ER -