An effective matrix compression method for GPU-accelerated thermal analysis

Lih Yih Chiou, Liang Ying Lu, Chieh Yu Lin

研究成果: Conference contribution

摘要

Three-dimensional integrated circuits are expected to face increasingly severe thermal challenges and cost issues as the number of stacked ICs increases. Thermal analysis for 3D ICs is urgently required to assist system designers at the early phase of design to identify hot zones. Most thermal analyses obtain detailed temperature distribution by large matrix operations, and hence reduce analysis performance. Accordingly, we propose a compressed and combined sparse row (CCSR) matrix format to be used in the proposed effective matrix compression (EMC) method for matrix multiplication on GPU. The experimental results show EMC using CCSR is on average 44.93 times faster than matrix multiplication without any special compression format and on average at least 3.09 times faster than other compression formats.

原文English
主出版物標題2015 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2015
發行者Institute of Electrical and Electronics Engineers Inc.
ISBN(電子)9781479962754
DOIs
出版狀態Published - 2015 5月 28
事件2015 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2015 - Hsinchu, Taiwan
持續時間: 2015 4月 272015 4月 29

出版系列

名字2015 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2015

Other

Other2015 International Symposium on VLSI Design, Automation and Test, VLSI-DAT 2015
國家/地區Taiwan
城市Hsinchu
期間15-04-2715-04-29

All Science Journal Classification (ASJC) codes

  • 硬體和架構
  • 電氣與電子工程

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